Microcontrol Electronic SRL

Via Giuba 11
Milano,  I-20132

  • Booth: C1455


Microcontrol Electronic srl, (MCE) , a100% privately owned company and part of the EMME CI GI group, has its headquarter in Milan - ITALY, and subsidiary offices in Roma and Catania. Founded in 1976 with the mission of servicing the italian semiconductor market , in 1985, it started designing and manufacturing its own products line. Microcontrol is now a leading supplier of equipment and service for the worldwide microelectronics industry , its portfolio includes laminating UV curing and handling systems , counting more than 500 units installed in 20 different countries , continuously supported by the technical service group. Microcontrol is renowed for the flexibility and reliability of its tools and always committed to accept every new challenge of the semiconductor industry.



  • Leonardo Series and Microl Wafer Eraser
    Leonardo Series and Microcontrol Wafer Eraser...

  • Microcontrol Electronic designed and manufactured a common handling platform to load the process stations of all our systems. It includes cassette holders, where  an RFID readr can be installed as option, or FOUP openers, 3 axis (or 4 in case of 300mm), Scara robot, automatic centering and aligning station where a wafer ID reader can be installed as option, a chuck where transfer  is positioned and driven to process area . 

    Process Applications:

    Photolithography , Wafer Thinning, Metallization, BEOL, UV Curing, On request 

    PHOTOLITHOGRAPHY - Photolithographic Film Deposition

    Leonardo Series DF - Lamination system - handles evry kind of films on the amrket being able to control tension, speed, temperature and pressure of film deposition. When polymer is completely laminated the heated cutter trims the two layers in contact with the edge of the wafer without leaving bobbles. 

    Leonardo Series LD : this sytem combines both photolithographic film lamination and cover sheet removal especially suggested to customers who have the need to remova the polyester layer immediately after the film deposition. Thanks to our software LD is able to perform a continuos process of lamnation and polyester removal involving up to 3 wafers inthe same time or selecting either one or the other process . 

    Leonardo Series BG - lamination system is developed to laminate any kind of films  on the market either UV or non UV . 

    Leonardo Series BG  - Mylar removal after back grinding process substrate is still covered by protective tape which needs to be removed . This system is especially designed to handle ultra thin warped or bowed wafers.

    Leonardo Series DLO a fully automatic system which , thanks to our experience in adhesive used to remove film, is able to remove the whole quantity of metals above sacrificial layer in only one dry metal lift off step. 

    BEOL Wafer frame Mounter : the process next to backside thinning is wafer dicing, in preparation to that, the back of the substrate is laminated together with a plastic or metal frame . Microcontrol Electronic Leonardo Series FM handles, from cassettesnor FOUL to frame, wafers up to 300 mm

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