SUPERIOR TECHNOLOGY FOR SINTERING,SOLDERING,DIFFUSION &CVD
Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.
SRO i-LINE: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC,Flip Chip
SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION
SRO-TCB THERMO COMPRESSION BONDER:300°C,Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering
PEO-601/-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose,ultra-uniform,LPCVD,CNT/graphene,VCSEL/AlGaAs/Si oxidation,diffusion,high vacuum,H2,annealing,alloying,LTCC sintering,thick film paste firing,Polyimide backing,Poly Si,Epitaxy,Si3N4,LTO,P & N solid source diffusion
PHP-630 LTCC SINTERING PRESS:1100°C:Constrained LTCC sintering,hot LTCC/glass embossing
DIAMOND SCRIBERS: to 200 mm Si Wafers,Al2O3, glass,InPh, GaAs