Kloé SA

Dilase 250, compact designed system for maskless photolithography, benefits from a continuous control on the dynamic trajectory of the motorized writing stages, with an absolute reference, and a large depth of focus, 1x20 minimum aspect ratio guaranteed. Thanks to this, Dilase 250 doesn’t need for an auto-focus system.

Standard laser sources and laser beam size available

Either equipped with a 375nm laser or a 405nm laser, this laser lithography system allows to create 1µm micro-structures.

Vectorial mode, scanning mode and a combination of both available

The user is offered the greatest flexibility, thanks to the three writing modes available. The vectorial writing mode ensures a perfect rendering of edges without stitching nor roughness, while the scanning enables to fill large surface very quickly. Combining these two writing modes makes it possible to obtain perfectly square pattern edges, with no roughness, in only one-pass laser processing.

Dilase 650 is a powerful, high resolution direct laser lithography system, offering a maximum of flexibility for your lithographic process.

Standard laser sources and laser beam size available

This maskless equipment can be delivered with 1 or 2 different laser sources (375nm or 405nm) and each of them can be associated with 1 or 2 different spot sizes (from 1µm to 50µm), enabling an optimized processing time by switching automatically on demand.

3 writing modes available

• The scanning mode to fill large surfaces, very quickly.
• The vectorial writing mode enables to smooth any contour without stitching nor roughness.
• The combination of both modes to ensure a perfect rendering of the edges, without compromising between rendering quality and achievement time.

High aspect ratio

Equipped with a very specific and unique optical treatment line developed by Kloe, the Dilase 650 offers you the possibility to achieve microstructures with a high aspect ratio of 1x50, in a one-pass laser.

UV-KUB 3, 4’’ or 6’’ version, is a very compact mask aligner (475 x 480 x 515mm and 55kg / 121lbs) for the patterning and alignment of 4ʺ or 6ʺ wafers.

No need for a cleanroom type environment

Fully operated by a touch-screen for exposure and controlled with a joypad for alignment operations, this new generation of mask aligners is particularly adapted for researchers needs, in many fields like microfluidics, integrated optical circuits, microelectronics, MEMS, semiconductor manufacturing…

Resolution and alignment precision

Compatible with all standard photoresists (AZ, Shipley, SU8, K-CL), UV-KUB 3 is a high resolution mask aligner offering the most competitive price on the international market, and it enables the realization of microstructures down to 0.8µ resolution and of overlays with an alignment precision inferior to 1µm.

UV-LED light source : high quality collimated exposure

The divergence angle below 2° makes possible to work on thick layers as well as on thin layers, with the same rendering of the edges and no roughness.