Key Advantages of Platform concept:
- Flexible setup, automatic wafer loading (same chamber)
- Production proven processing chamber (up to 300 mm) and components setup (SEMI certified)
- Unique bridge tool 100 to 200 mm with manual or fully automated production capability
- Precise ambient control, including vacuum capability
- Advanced temperature measurement and control for 50 < T < 1300 degree C
- Independent lamp and power control for individual tuning of linear tungsten halogen lamps
- Corssed lamp fieleds or single side heating
- Fully automated box/susceptor processing up to 1600 degree C
- Ultra-fast cooling capability
Applications for Si, Ge, GaAs, GaN, SiC, etc.
- Annealing / dopant activation / defect dissolution
- Oxidations of various kinds
- ONO (Oxidation - Nitridation - Oxidation)
- Ohmic contact formation
- Silicide formations (NiSi, CoSi2, TiSi2)
- Densification
- Substrate modification (TDA, MDZ, etc.)