Wet processing systems for IC manufacturing & WLP
ACM Research, Inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor IC manufacturing and wafer-level packaging applications. The company specializes in developing cleaning technologies for advanced semiconductor device manufacturing.
To address increasing challenges in defect reduction that plagued emerging generations of IC chips, ACM Research developed its innovative single-wafer cleaning equipment, which features the company’s proprietary Space Alternated Phase Shift (SAPS™) and Timely Energized Bubble Oscillation (TEBO™) megasonic cleaning technologies. In particular, ACM’s revolutionary TEBO technology is enabling future generations of semiconductor capability. These capabilities are delivered on high-throughput chamber and platform designs.