Chip Integration Technology Center (CITC)
CITC is a non-profit joint innovation center that specializes in heterogeneous integration and advanced packaging technology for chips. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
We organize and run innovation programs in the field of chip packaging and integration technology. CITC’s current program lines include:
- Thermal High-Performance Packaging
- RF Chip Packaging
- Digital Package Manufacturing
- Integrated Photonics Packaging
Access to Infrastructure
We maintain lab facilities that support the innovation programs but also support the education programs through internships and MSc/PhD programs. CITC has a Smart Industry Field Lab status.
Access to Education
We collaborate with universities, universities for applied sciences and companies to support and provide packaging and chip integration technology related education. This includes internships, MSc/PhD programs, and a specific Semiconductor Packaging University Program (together with HAN University of Applied Sciences).