ONTOS Equipment Systems
343 Meadow Fox Lane
ONTOS TT Atmospheric Plasma
The OntosTT, is a semiautomatic Atmospheric Plasma System for surface preparation. It provides a simple, effective, clean surface modification method which does not require the throughput- robbing vacuum chamber associated with traditional plasma systems....
Uniquely‐designed atmospheric plasma source with 25, 40 or 100 mm‐wide process zone. The glow discharge‐type plasma is entirely contained inside the source.
Computer‐controlled X‐Y‐Z stage. In the standard version, the vacuum chuck accommodates die or wafer from 2 to 200 mm (300mm with the 300mm version). The system can handle substrate thicknesses up to 20 mm.
300 W RF generator (600W when Plasma-Head 100mm is installed) has a wide‐range auto‐tune network, system computer control and monitoring of forward and reflected power. Safety interrupts.
4 Mass Flow controllers provide precise digital control of gas to the plasma source.
ESD‐safe, interlocked enclosure; Exhaust for process gases (no scrubber required).
Fully Automatic system supplied with its control laptop. Software developed in LabVIEW™. Menu‐driven interface with user configurable recipe libraries.
apparatus – no vacuum chamber.
entirely within the process head, never contacting the chip/wafer.
radical chemistry only.
exposure to: arc discharges, ions, bombardment, re-deposition, or spalling particulates.
CMOS safe, Detector safe.
process – continuous throughput capable.
process. OSHA- and EPA-friendly.
Very effective at removing
organic contamination films
and loose particles.
Reduces native oxides
on metallic surfaces: In, Ni, Cu, solders.
Can add surface
against re-oxidation – removal not required.
207 Process Equipment
Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
307 Process Materials
Plasma; Ion Sources
Plasma Sources; Controls; Monitoring; Diagnosis
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