PVA SPA Software Entwicklungs GmbH

Seifartshofstrasse 12 - 14
Coburg,  D-96450

  • Booth: B1706

We are looking forward seeing you at our booth B1706!

PVA TePla — is not just about high-tech products, innovative systems and materials, dynamic processes, experts, and companies. It means fully developed structures, an open corporate culture, and responsible actions.

By linking with innovative strength, we open up clear competitive advantages for our customers in existing markets and in new application fields—from the semiconductor industry to vacuum technology all the way to material analysis.

PVA SPA Software Entwicklungs GmbH is a medium-sized company based in Coburg, Germany, which has focused on the semiconductor market since its foundation in 1989. It supplies customers worldwide with specific software programs for industrial automation processes in semiconductor manufacturing. In addition, SPA also offers complete machine solutions with optical components for manual to fully automated quality assurance of semiconductor products. An integrated Industry 4.0 connection via SECS/GEM300 or MES coupling are available for all their machines.


  • Enhanced Backside Inspection System (EBIS)
    EBIS synchronizes visual defects located on a wafer backside to the frontside chip structure. Optimize your yield by precise automatic detection or manual marking of only the affected fail chips, and thus avoiding oversized fail area classifications!...

  •  Key benefits of the EBIS:

    • Fast automatic loading and scanning process (up to 250 WPH)
    • Full automatic macroscopic defect detection on wafer backside (defects >60µm)
    • Optional visualization of complete wafer backside on the screen for defect marking or reviewing AOI results
    • Transparent wafer frontside overlay on backside image during review process
    • Automatic wafermap edit when backside defect is detected based on given threshold parameters
  • UL200 wafer loader
    The UL200 serves as a compact and fast tabletop wafer loading system for up to 8” bare wafers with customer-specific requirements....

  •  Key benefits of the UL200:

    • Wafertype-specific and dynamic wafer detection for safe loading from cassette
    • Automatic loading of 100-150mm or 150-200mm wafers
    • Prealignment of wafer position and rotation
    • Single and multi wafer handling to xy table
    • Docking compatibility for manual or automatic xy tables
    • ID Reading integrated within UL200
    • Footprint approx. [mm] 620x630

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