FRT GmbH

The FRT MicroProf AP also provides comprehensive measurement solutions for backside processing (backgrinding, metallization) for power semiconductors such as MOSFET or IGBT, as well as for the control of different substrates, e.g. bulk Si, SOI, cavity SOI, compounds such as GaAs, InP, SiC, GaN, ZnO, and also for transparent materials. Furthermore, it can be used for hybrid bonding and Micro Electro Mechanical Systems (MEMS), included in consumer electronics, automotive, telecom, medical and industrial markets. With its modular multi-sensor concept, the flexible MicroProf AP measuring tool is ideally suited to perform a variety of measuring tasks in advanced packaging.

Learn more here.

Flexibility and versatility are keywords when it comes to metrology solutions for today’s silicon foundry applications. MicroProf FS provides a modular approach to create a fully automated multi-sensor tool that can solve all required measurement tasks. That’s why we call it the Foundry Star!

For its core metrology component, the proven FRT MicroProf 300 multi-sensor metrology tool is used to allow the measurement of different products and – by using a hybrid metrology concept – enhances the precision of measurements on samples where a single sensor or measuring principle is just not enough. The measurement system of the MicroProf FS is equipped with a granite base setup, with a three-point sample fixture or a vacuum chuck.

Learn more here.

Besides the standard configuration, the FRT MicroProf FE can be equipped with numerous additional features, which can also be retrofit later.

Learn more here.

The option for two-sided sample measurement allows the simultaneous measurement of the top and bottom surface with determination of the sample thickness, total thickness variation (TTV) and various surface parameters such as roughness, waviness and flatness of both sides. A complete wafer shape measurement is also possible with analysis of the global and local wafer parameters. A wafer sorting function is available, which is adjustable according to customer requirements. Based on SurfaceSens technology, additional sensors can be retrofitted later. A further application of the MicroProf MHU is the layer thickness determination of thin films, as well as layer stacks, measurement of step heights, bumps, vias (TSVs), trenches, etc.

Learn more here.

The MicroProf DI includes several modules that can be flexibly combined on the same tool platform, covering all wafer surfaces at high throughput for efficient process control. The modules include optical inspection and classification of defects via single-shot and step camera module, review of defects via a high-precision microscope and comprehensive multi-sensor metrology with different topography and layer thickness sensors. For the optical, non-contact and non-destructive analysis of hidden structures and inclusions in the wafer, interferometric layer thickness sensors with infrared light source and an IR microscope are also available.

Learn more here.

SurfaceSens offers you the possibility to combine unique metrology and inspection measuring principles in one single tool and thus allows maximum flexibility. The set-up, even for top and bottom sample measurement, with various optical sensors, like point, line and field of view sensors facilitates versatile results about several surface parameters, such as topography, roughness, TTV bow and warp, flatness, coplanarity, sample and layer thickness, and many others.

Learn more here.