Join our talk at the APC on November 18 at 14:45!
ZEISS has the most comprehensive portfolio of light, X-ray, electron beam and ion beam imaging technologies in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterization and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices.