SUSS MicroTec

Schleissheimer Str. 90
Garching,  85748

  • Booth: B1241

We are looking forward to see you at Semicon Europa.

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, laser processing and photomask cleaning, complemented by micro-optical components.
In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint Lithography as well as key processes for WLP and MEMS manufacturing. With its global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.

 Press Releases

  • SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and SET will provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry's path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.

    Garching, Germany and Saint-Jeoire, France, September 1, 2021 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry announces a joint development agreement (JDA) with SET, a leading supplier of high precision flip-chip bonders. The main focus of the JDA is the development of a fully automated, customizable, highest-yield sequential die-to-wafer hybrid bonding equipment solution by combining SUSS MicroTec's expertise with FEOL-compatible automated surface preparation of wafers and singulated dies which are populated on a wafer or frame and SET's ultra-high accuracy die-placement technology, which will be further enhanced by high-performance metrology that offers closed-loop feedback to the bonding system.

    At a time where traditional transistor-scaling is approaching its limit, 3D packaging and heterogeneous integration have already been widely adopted in the industry in order to further increase the performance and functionality of today's semiconductor devices. However, today's 2.5D and 3D packaging schemes are limited by the minimum interconnect density that traditional microbump technology can offer. Hybrid bonding solves this problem by bonding the direct contact between two metal pads (mostly copper) and surrounding dielectrics in one single bonding step. This bumpless bonding approach allows for substantially smaller pitches and higher interconnect density which are the key enablers for future generations of multi-die solutions.

    Interconnect density scaling is driven by a number of fast-growing applications that include power computing, artificial intelligence (e.g. autonomous driving), 5G mobile, as well as a variety of additional More-than-Moore devices such as next-generation CMOS image sensors. To obtain high yields for devices with high interconnect densities customers not only require ultra-precise die-placement solutions, but also reliable surface activation and a process guaranteeing particle-free surfaces.

    As part of this partnership, SUSS MicroTec's high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET's latest ultra-high accuracy D2W hybrid bonding platform. Closed-loop feedback between the metrology and the die-bonder module will help to continuously monitor and optimize the overlay performance, enabling consistent die-placement accuracy below 200 nm as well as interconnect pitch scales in the sub-micron region. The modular, highly flexible equipment concept allows for stand-alone surface preparation and hybrid bonding as well as a fully integrated equipment solution depending on the specific application and/or customer requirements. This concept also enables an integrated cluster approach that can support all individual hybrid bonding paths in a single platform: wafer-to-wafer (W2W), collective die-to-wafer (CoD2W) and/or sequential die-to-wafer (D2W).

    Goetz M. Bendele, PhD, CEO of SUSS MicroTec, puts this into perspective: "Hybrid bonding is one of the main growth drivers of the advanced semiconductor backend equipment space, as well as one of the main growth levers for SUSS MicroTec. With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET's leading-precision die placement technology with SUSS's proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers' fabrication sites."

    Pascal Metzger, PhD, CEO of SET: "Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory state to an industrial state. Thus in September 2019, SET launched a stand-alone machine - the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process. This will permit to provide a complete industrial solution to our customers, for applications coming in the very near future such as HPC, IA, 5G and many other more, to diversify our offer and address new market segments."

    For more details on Hybrid Bonding at SUSS MicroTec please visit our website:

  • The University of St. Gallen in Switzerland recognizes SUSS MicroOptics with the "Swiss Manufacturing Award" for its outstanding contribution to Switzerland's manufacturing ecosystem.

    Neuchâtel, Switzerland, October 27, 2021 - SUSS MicroOptics SA, located in Neuchâtel and part of technology company SUSS MicroTec SE, has received the 2021 "Swiss Manufacturing Award", in recognition of its outstanding contribution to the microtechnology industry in this region. The company develops pioneering technologies and manufacturing processes for a variety of industrial applications that are finding broad consumer use. The company currently employs 142 people, producing exclusively in Neuchatel, Switzerland.

    The Institute of Technology Management at the University of St. Gallen honors companies that choose Switzerland as a manufacturing location with this prestigious award. The selection of winners is based on financial, production, and market figures as well as the company's positioning in terms of investment in production capacity and technology in Switzerland within the past year.

    "I am extremely excited about having won this award. It is an outstanding recognition of the whole team at SUSS MicroOptics which has worked very hard over many years. With the new production capacity we will bring automotive lighting to a new level", says Reinhard Voelkel, CEO of SUSS MicroOptics.

    SUSS MicroTec has made significant investments to develop new and upgraded production capacity and set up a new manufacturing site in Neuchâtel, including cleanroom space which quadruples overall production capacity. In addition, the existing high-volume manufacturing of innovative optics for automotive lighting will be significantly increased with the ramp-up of a new product line by the end of this year.

    "I am very happy that our team in Switzerland has been recognized for their performance with this award, and our best wishes go to our colleagues here", says Dr. Goetz M. Bendele, CEO of SUSS MicroTec. "As a key growth driver for our company, SUSS MicroOptics represents the future of how we let technology deliver solutions to our customers which in turn deliver significant value to them. I look forward to when lighting solutions using SUSS micro-lens arrays are used and appreciated by consumers worldwide".

    SUSS MicroOptics has in-depth expertise when it comes to high-quality refractive and diffractive micro-optics and is a key supplier for innovative photonic solutions in telecom, datacom, life science, laser, semiconductor equipment and automotive lighting applications. The company mass-produces microstructure components and highly specialized optics such as micro-lens arrays in its state-of-the-art cleanroom facilities. With its end-to-end know-how along the value chain, from basic optical design to in-depth manufacturing process insights, as well as the use of state-of-the-art technology, the company enables its customers to achieve rapid time-to-market from pre-development to stable, high-yield high-volume series production.


  • SUSS XBS300 Hybrid Bonding Platform
    The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip)....

  • The universal XBS300 platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost-of-ownership for customers.  Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip). Learn more ...

  • SUSS LP50 Inkjet Printer
    The advanced research inkjet printer SUSS LP50 is designed for research and development of inkjet processes and applications....

  • The PiXDRO LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for research and development of inkjet processes and applications, as well as evaluation and development of inkjet materials.

    The PiXDRO LP50 platform is an open, accurate, flexible and easy-to-use system that will allow you to work at the cutting edge of inkjet printing technology. It is designed for a wide range of applications such as semiconductor packaging, PCBs, printed electronics, photovoltaics, displays and biomedical. Learn more ...

  • SUSS MA8 Gen5 Mask Aligner
    Compact Imprint Aligner Platform for Research and Mid- to Large Scale Production...

  • The MA8 Gen5 represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner. The new platform introduces improved imprint processing features for standard, advanced and high-end processes.

    The MA8 Gen5 offers an enhanced ergonomic and user-friendly design, cost efficiency and a reduced footprint, and is the perfect tool for use in research and mid- to large-scale production.

    SUSS MicroTec’s MA8 Gen5 is setting a new benchmark in full-field lithography for MEMS & NEMS, 3D integration and compound semiconductor markets, especially for a large variety of imprint applications in the field of LED, MEMS/NEMS, micro-optics, augmented reality and opto-electronic sensors using the renowned SMILE technology. It is also able to handle processes such as bond alignment and fusion bonding.

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