Liebigstrasse 8
Kirchheim b. Muenchen,  D-85551

  • Booth: B1201

Visit us for advanced Dicing, Grinding & Polishing solutions

DISCO is a total solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies.

< Technology area >

- Wafer dicing by blade, laser or plasma

- Wafer thinning by grinding and polishing (Dry polishing, CMP, etc.)

- Special processes by laser (Please consult with us.)

- Special processes like TAIKO, DBG and KABRA. (See our website.)

- Surface planarization

- Dicing tape and Grinding tape

- Wafer mounter

- Expander / Die separator

- Camtek AOI (Automatic Optical Inspection)

- TECNISCO glass and metal parts

- Dicing Grinding Service and Camtek optical inspection service are available in our cleanroom at Munich office. We accept orders even from a small quantity. Please also visit http://www.dicing-grinding.com/

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