SCIL Nanoimprint Solutions

High Tech Campus 11
Eindhoven,  5656 AE

Netherlands
http://www.scil-nano.com
  • Booth: B1125


We give your surface a function

Many products like smart phones, smart glasses, displays and cars require high-performance nanophotonics for sensing and vision applications.

However, for nanophotonics, conventional lithography techniques have drawbacks like expensive tools, complex processes and low yield.

SCIL Nanoimprint Solutions offers cost effective, robust, high yield manufacturing solutions for the creation of nanometer resolution patterns on a large variety of materials. It can be used to make patterns with feature sizes down to less than 10 nm and overlay alignment below 1 µm. 

With the combination of imprint equipment, imprint materials and process know-how SCIL Nanoimprint solutions helps customers to transform their nano-structuring dreams into production reality.

The SCIL Application Center supports in:

  • development of the right imprint process based on our customers' input and requirements;
  • using optimized equipment and consumables;
  • production of wafers that our customers need for their qualification processes
  • transfer the SCIL imprint process to the SCIL equipment at your production site

The advantages are clear:

High volume production, Fast development cycles, Solutions that are cost efficient and very reliable


 Products

  • LabSCIL
    The low volume LabSCIL tool is especially developed for R&D labs at Universities, Research Institutes and companies who are interested to develop SCIL processes and applications and for small series pilot production....

  • Key features
    • Easy to operate stand-alone SCIL imprint unit.
    • Tri-layer stamp construction allows conformal contact printing even on nonflat and bowed surfaces.
    • Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles.
    • The excellent etch properties of the sol-gel resist result in high etch rates.
    • The thermal stability, optical transparancy and (UV) stability of the sol-gel makes it suitable as functional layer.
    • Use of sol-gel increases stamp lifetime to 500 imprints and more.
    • Overall combining highest imprint quality and yield with high throughput and low total cost of ownership.

    Specification

    Operation Manual loading of wafers with a reist coating. Imprint process runs automatically.
    Wafer sizes  2” up to 8” (or 200 mm)
    Wafer thickness 0.3 - 2.5 mm
    Wafer handling Manual loading in a tray
    Resist types Thermal sol-gel
    UV sol-gel
    UV organic
    Imprinting  SCIL low pressure softstamp NIL
    Overlay alignment Full wafer < 1μm
    Dimensions
    (WxLxH)
    1.8 x 1.4 x 2.2 m
  • AutoSCIL
    The fully automatic AutoSCIL includes all essential process steps in a closed coupled system: wafer handling, aligning, spin-coating, SCIL imprinting, baking and cooling. This tool also offers highly accurate overlay alignment as an option....

  • Key features
    • Integration of all essential proces steps in one closed coupled system.
    • Tri-layer stamp construction allows conformal contact printing even on nonflat and bowed surfaces.
    • Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles.
    • The excellent etch properties of the sol-gel resist result inhigh etch rates.
    • The thermal stability, optical transparancy and (UV) stability of the sol-gel makes it suitable as functional layer.
    • Use of thermal sol-gel increases stamp lifetime.
    • Overall combining highest imprint quality and yield with high throughput and low total cost of ownership.

    Specification

    Throughput 30 - 60 wafers/hour depending on wafers size, wafer material, pattern dimensions and material process
    Wafer sizes  2” up to 8” (or 200 mm)
    Wafer thickness  0.3 - 2.5 mm
    Wafer handling Cassette-to-cassette, aligning, robot
    handling
    Resist types

    Thermal sol-gel
    UV sol-gel
    UV organic

    Resist coating

    Integrated spin coating system, inkjet optional

    Imprinting 

    SCIL low pressure softstamp NIL

    Post processing

    Baking and cooling

    Alignment

     Full wafer < 1μm

    Dimensions (WxLxH)

    1.9 x 1.6 x 2.2 m
  • FabSCIL
    The FabSCIL module can imprint 200 and 300mm wafers and has automatic stamp loading and positioning. It is connected to a cluster system that takes care of wafer handling, spin-coating, spin-coating, baking, cooling and other processes....

  • Key features
    • Designed to be connected to a cluster system that takes care of wafer handling, aligning, spin-coating, baking, cooling and other processes.
    • Automatic stamp loading and positioning.
    • Tri-layer stamp construction allows conformal contact printing even on nonflat and bowed surfaces.
    • Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles.
    • The excellent etch properties of the sol-gel resist result in high etch rates.
    • The thermal stability, optical transparancy and (UV)stability of the sol-gel makes it suitable as functional layer.
    • Use of thermal sol-gel increases stamp lifetime.
    • Overall combining highest imprint quality and yield with high throughput and low total cost of ownership.

    Specification

    Throughput 20—40 wafers/hour depending on wafers size, wafer material, pattern dimensions and material process
    Wafer sizes 200 and 300 mm
    Wafer thickness 0.3 - 2.5 mm
    Wafer handling Connected to cluster tool / EFEM
    Resist types Thermal sol-gel
    UV sol-gel
    UV organic
    Imprinting SCIL low pressure softstamp NIL
    Dimensions  (WxLxH) 1.5 x 1.0 x 2.5 m
    Overlay alignment Full wafer < 1μm
  • NanoGlass Imprint Resist
    NanoGlass allows direct patterning of silicon oxide glass with nanometer resolution and can be directly used as hard mask in RIE processes. Due to the light and temperature stability of imprinted silica it can directly be used in (optical) applications....

  • Key features
    • Inorganic resist for Nanoimprint Lithography.
    • Thermodynamic driven curing (NanoGlass-T™).
    • Applied by spin coating or inkjet printing
    • Good adhesion to a plethora of substrates including Si, SiO2, glass, Al, Al2O3, Ti, TiO2 Au, PE, Cr, PMMA, GaAs, GaN.
    • Allows direct patterning of silicon oxide glass with nanometer reso-lution.
    • Due to superb light and temperature stability it can directly be used in (optical) applications.
    • Can be used as hard mask in RIE processes for high fidelity pattern transfers.
    • Very high selectivity towards Cr, Al, Si in etching
    • Superior mold release properties.

    Specifications

    Description Fully inorganic imprint resist
    Viscosity ~2-10 mPa·s
    Refractive index 1.42—1.45
    Film thickness @ 1000 rpm 50 nm - 250 nm
    Max. aspect ratio Pillar: 8
    Lines: 3-5
    Minimum residual layer < 10 nm

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