ONTOS Equipment Systems

343 Meadow Fox Lane
Chester,  NH  03036

United States
  • Booth: B1128


  • ONTOS TT Atmospheric Plasma
    The OntosTT, is a semiautomatic Atmospheric Plasma System for surface preparation. It provides a simple, effective, clean surface modification method which does not require the throughput- robbing vacuum chamber associated with traditional plasma systems....


    • Uniquely‐designed atmospheric plasma source with 25, 40 or 100 mm‐wide process zone. The glow discharge‐type plasma is entirely contained inside the source.
    • Computer‐controlled X‐Y‐Z stage. In the standard version, the vacuum chuck accommodates die or wafer from 2 to 200 mm (300mm with the 300mm version). The system can handle substrate thicknesses up to 20 mm.
    • 300 W RF generator (600W when Plasma-Head 100mm is installed) has a wide‐range auto‐tune network, system computer control and monitoring of forward and reflected power. Safety interrupts.
    • 4 Mass Flow controllers provide precise digital control of gas to the plasma source.
    • ESD‐safe, interlocked enclosure; Exhaust for process gases (no scrubber required).
    • Fully Automatic system supplied with its control laptop. Software developed in LabVIEW™. Menu‐driven interface with user configurable recipe libraries.

    OntosTT Advantages

    • Simple apparatus – no vacuum chamber.
    • Plasma is contained entirely within the process head, never contacting the chip/wafer.
    • Ultra-Clean Processing.
    • Downstream radical chemistry only.
    • No exposure to: arc discharges, ions, bombardment, re-deposition, or spalling particulates.
    • CMOS safe, Detector safe.
    • Fast process – continuous throughput capable.
    • Non-toxic, dry process. OSHA- and EPA-friendly.
    • Very effective at removing organic contamination films and loose particles.
    • Reduces native oxides on metallic surfaces: In, Ni, Cu, solders.
    • Can add surface passivation against re-oxidation – removal not required.

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