Carl Zeiss Microscopy

Carl-Zeiss-Strasse 22
Oberkochen,  D-73447

  • Booth: B1361

Join our talk at the APC on November 18 at 14:45!

ZEISS has the most comprehensive portfolio of light, X-ray, electron beam and ion beam imaging technologies in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterization and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices

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