PVA Metrology & Plasma Solutions GmbH

Im Westpark 10-12
Wettenberg,  35435

  • Booth: B1706

We are highly looking forward seeing you at our booth!

PVA TePla — is not just about high-tech products, innovative systems and materials, dynamic processes, experts, and companies. It means fully developed structures, an open corporate culture, and responsible actions.

By linking with innovative strength, we open up clear competitive advantages for our customers in existing markets and in new application fields—from the semiconductor industry to vacuum technology all the way to material analysis.

PVA Metrology & Plasma Solutions: We specialize in understanding the processes involved in the manufacture of semiconductor, micromechanical, and optoelectronic components. As a result, we assist our customers with plasma processes as well as analysis methods with laser-based measurements and VPD methods.


  • Batch Wafer Systems / Plasma System GIGAbatch 360/
    The GIGAbatch product family represents an effective solution for the requirements of the plasma treatment inside the Frond End area....

  • The Front End batch plasma systems of PVA MPS are designed to provide a higher throughput for less sensible wafer plasma applications. For higher uniformity demands, MPS offers its single wafer plasma family GIGAfab.

    GIGAbatch plasma systems are available for 6” and 8” wafer diameter and in a variety of different equipment levels and machine options. Coming from the “M” level with its manual loading door, the next step is the “P” level with automatic loading door and cleanroom suitable stainless steel and glass surfaces. The highest level regarding equipment and performance is the GIGAbatch A380P. This machine type is equipped with a so-called WTU; a wafer transfer unit. Such kind of unit is connected to the automatic door of the plasma system. A wafer containing magazine can be placed on the WTU, and the WTU is automatically transferring the wafers from the magazine into a quartz boat on the loader door. After this handover of the wafers to the machine, the machine is now able to plasma-treat the wafers automatically.

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