Visit us for advanced Dicing, Grinding & Polishing solutions
DISCO is a total solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies.
< Technology area >
- Wafer dicing by blade, laser or plasma
- Wafer thinning by grinding and polishing (Dry polishing, CMP, etc.)
- Special processes by laser (Please consult with us.)
- Special processes like TAIKO, DBG and KABRA. (See our website.)
- Surface planarization
- Dicing tape and Grinding tape
- Wafer mounter
- Expander / Die separator
- Camtek AOI (Automatic Optical Inspection)
- TECNISCO glass and metal parts
- Dicing Grinding Service and Camtek optical inspection service are available in our cleanroom at Munich office. We accept orders even from a small quantity. Please also visit http://www.dicing-grinding.com/