We are looking forward welcoming you on our booth C1904!
Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.
PEO-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose,ultra-uniform, LPCVD, oxidation, high vacuum, annealing, alloying, LTCC sintering,thick film paste firing, Polyimide backing, Poly Si, Si3N4, P&N solid source diffusion
SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC, Flip Chip
SRO 7XX Series: IR Vacuum Reflow Systems for R&D and production, void free-IGBT-CSP-DBC, Flip Chip, package sealing
SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION
SRO-TCB THERMO COMPRESSION BONDER: 300°C, Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering
DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs