Park Systems Europe GmbH

As the demand for Atomic Force Metrology for larger flat panel displays increases, Park NX-Tip Scan Head overcomes nanometrology challenges for samples over 300mm. The Tip Scanning Head (TSH) and gantry style air-bearing stage allows Park NX-TSH to accurately image roughness measurement, step height measurement, and critical dimension measurement.

The fully Automated Tip Scanning Head for OLED, LCD, and 2D encoder sample

• Tip Scanning Head in X, Y and Z directions, up to 100 µm x 100 μm (x-y direction) and 15 μm Z-direction
• Flexible chuck to accommodate large and heavy samples over 300mm and 1KG
• Long Range Air-bearing XY stage for AFM analysis of industrial samples larger than 300 mm
• 100 µm x 100 µm Flexure-Guided XY Scanner with Closed-loop Dual Servo System
• 15 µm High Speed Z Scanner with Low Noise Position Sensor
• Automatic Measurement Control and automated system features such as live monitoring of the measurement process, automatic analysis of acquired measurement data, and more!

A fully automated industrial AFM using NX technology

• NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
• The low noise Z-detector works on an independent, closed loop to minimize errors in topography
• True Non-contact™ mode allow for the collection of high resolution and accurate data without tip-sample damage

Innovative head design for undercut and overhang structures

• Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
• Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material

A Reliable, Seamless Measurement Tool for 3D materials

• No sample preparation is required to obtain the sidewall roughness or critical dimension measurements in this process

Unique features:

Low noise Atomic Force Profiler for accurate, high throughput CMP profile measurements

Sub-Angstrom surface roughness measured with extreme accuracy and minimized tip-to-tip variation

Smart ADR Software

With Park's Smart ADR NX-Wafer provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.
Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.

Read more: https://www.parksystems.com/index.php/products/industrial-afm/park-wafer/overview

Inline Automation, for Fast, Accurate, and Repeatable PTR Measurements

The hard disk drive slider manufacturing industry demands a tool that provides fast, streamlined Pole Tip Recession Measurements while still maintaining the highest standard of accuracy available. It demands a tool like the Park NX-PTR. The NX-PTR offers extremely accurate PTR measurements to process engineers with inline automation that increases throughput. This makes it the perfect solution for HDD slider manufacturers looking to maximize their quality and production yield.

High Throughput, with No Need for Multiple Reference Scans

Our crosstalk eliminated scan system allows for truly flat scans, effectively eliminating the multi-scan process. In addition, True Non-Contact Mode™ preserves tip sharpness for prolonged high-resolution imaging and much longer tip life. This lets the Park NX-PTR generate accurate images of highly detailed regions of interest within larger macrostructures, without any need of reference scan to correct various scanner artifacts.

Park NX-Mask is the new generation photomask repair system that addresses the latest challenges of shrinking device geometries and increasing photomask complexities. It is an innovative tool for the repair of high-end EUV Mask incorporating advanced atomic force microscopy technology. It provides all in one solution from auto defect review to repair of defects to verification of the repair, accelerating the throughput at unprecedented repair efficacy.

Key Features

• No risk of damage and seamless repair of any type of defects
• Compatible with a dual pod for handling EUV masks
• All-in-one solution for locating defects and post-repair verification

How it works

Park NX-Mask first performs a survey scan to locate the defects using its proprietary non-contact AFM technology that offers the safest method of scanning. From the survey scan, Park NX-Mask learns the quantity and precise location of the defects, and information on each of those particles and faults.

More powerful failure analysis solutions

Park NX20 is equipped with unique features that make it easier to uncover the reasons behind device failure and develop more creative solutions. Its unparalleled precision provides high resolution data that lets you focus on your work, while its True Non-Contact™ mode scan keeps tips sharper and longer, so you won’t have to waste as much time and money replacing them.

Easy to use, even for entry level engineers

Park NX20 has one of the most user-friendly designs and automated interfaces in the industry, so you won’t have to spend as much time and energy using the tool and supervising junior engineers with the system. This lets you focus your experience on solving bigger problems and providing insightful and timely failure analysis to your customers.