Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.
SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC, Flip Chip
SRO 7XX Series: IR Vacuum Reflow Systems for R&D and production, void free-IGBT-CSP-DBC, Flip Chip, package sealing
SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION
SRO-TCB THERMO COMPRESSION BONDER: 300°C, Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering
PEO-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose,ultra-uniform, LPCVD, VCSEL/AlGaAs/Si oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering,thick film paste firing, Polyimide backing, Poly Si, Si3N4, P&N solid source diffusion
DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs