ATV Technologie GmbH

Johann-Sebastian-Bach-Strasse 38
Vaterstetten,  D-85591

Germany
http://www.atv-tech.com
  • Booth: C1904

Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.

SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC, Flip Chip

SRO 7XX Series: IR Vacuum Reflow Systems for R&D and production, void free-IGBT-CSP-DBC, Flip Chip, package sealing  

SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION

SRO-TCB THERMO COMPRESSION BONDER: 300°C, Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering

PEO-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose,ultra-uniform, LPCVD, VCSEL/AlGaAs/Si oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering,thick film paste firing, Polyimide backing, Poly Si, Si3N4, P&N solid source diffusion

DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs

 Products

  • PEO-604
    The PEO-604 is ideal tool for R&D purposes, pilot line and mass production. It can be applied easily for new unique and sophisticated process development as well low to medium volume production applications....

    • This multipurpose furnace has several key aspects integrated and can handle wafers up to 200mm.Next to floor space saving advantages the PEO also has close to Zero energy usage in ambient stand-by. Another unique aspect of the system is the multi process capability when using our easily exchangeable liners. To reach the optimal temperature uniformity ATV uses 14 Kanthal heating elements which are positioned around, at the front and at the back side of the process tube and are PID controlled

    Please visit https://www.atv-tech.com/peo-604 and see more details about our PEO-604

Categories

200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Solder Reflow; Soldering & Brazing Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 207 Process Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment

    • Send Email

    Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

    Back to the Search
    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined