They are ideally suitable for wafer inspection, bond interface checking, MEMS inspection and inspection of different types of electronic packages. An automatic defect-review software package performs a fully automated evaluation of the defect types. The results can be issued as klarf files and VEGA MAP. A GEM/SECS or MES connection is also available.
According to the to be analyzed samples, different scanner configurations like 4x1, 4x2 or 4x4 are available. Additionally, transducers can be configured from 4 up to 8 channels.
The handling of the samples into the machine, can be individualized with Open Cassettes, SMIF Loader, FOUP Loader, JEDEC Trays or loading stations.
SAM Autowafer
The SAM 300 Auto Wafer is product line specially developed for inline production control. It conforms to cleanroom class 100 or 1000 and was designed for the inspection of wafer interfaces, bonded wafers (MEMS) or hybrid bonding applications to detect cavities, inclusions, delamination or micro voids. Multiple transducer configuration enables maximum through put for wafer inspection.
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