EV Group (EVG)

The LITHOSCALE system featuring EV Group’s MLE™ maskless exposure technology tackles legacy bottlenecks by combining powerful digital processing that enables real-time data transfer and immediate exposure, high structuring resolution and throughput scalability. Its mask-free approach eliminates mask-related consumables, while the exposure system with its tunable solid-state laser source is designed for high redundancy and long life-time stability with unique auto-calibration capabilities that minimize maintenance. Powerful real-time digital processing enables immediate exposure from the design-file to the substrate – thereby avoiding hours of conversion time for each digital mask layout.  LITHOSCALE features high-resolution (<2µm L/S), dynamically die-level addressable exposure of the entire substrate surface, which enables agile consumable-free processing and low cost of ownership (CoO). The LITHOSCALE system integrates full-wafer top-and-backside alignment utilizing dedicated objectives with visible and IR capability and proprietary chuck designs accommodating wafer sizes up to 300 mm. The system features dynamic alignment modes with an automatic focus, in order to adapt to the substrate material and surface variations. The ability to finely control focus level position keeps sidewalls steep as well as desired 3D contour of the resist, while preventing edge topping and footing. Large working distance and automatic adaptive focus ensures patterning uniformity across the exposure surface. It also offers individualized die processing capability, while fast full-field positioning and dynamic alignment enable high scalability for a range of substrate sizes and shapes.

Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.

The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

The EVG®40 NT2 automated metrology system provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and die-to-die (D2D) bonding as well as maskless lithography applications. Designed for high-volume production with feedback loops for real-time process correction and optimization, the EVG40 NT2 helps device manufacturers, foundries and packaging houses accelerate the introduction of new 3D/heterogeneous integration products as well as improve yields and avoid scrapping of highly valuable wafers.

The EVG ComBond high-vacuum wafer bonding platform marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. The application areas supported by the EVG ComBond range from advanced engineered substrates, stacked solar cells and power devices to high-end MEMS packaging, high-performance logic and “beyond CMOS” devices. The modular cluster design of the EVG ComBond system allows for a highly flexible platform that can be tailored to various demanding customer needs both in R&D and high-throughput, high-volume manufacturing environments. The EVG ComBond facilitates the bonding of heterogeneous materials with different lattice constants and coefficients of thermal expansion (CTE) as well as the formation of electrically conductive bond interfaces by its unique oxide-removal process. The EVG ComBond high-vacuum technology also enables low-temperature bonding of metals, such as aluminum, that re-oxidize quickly in ambient environments. Void-free and particle-free bond interfaces and excellent bond strength can be achieved for all material combinations.