PHIX Photonics Assembly

De Veldmaat 17
Enschede,  7522 NM

Netherlands
  • Booth: C1329


We are a packaging foundry for integrated photonics.

PHIX offers assembly services and contract manufacturing for photonic integrated circuits (PICs) and MEMS. We build optoelectronic modules based on all major PIC technology platforms, such as Indium Phosphide, Silicon Photonics, Silicon Nitride, and Planar Lightwave Circuit.

We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing.

PHIX provides a one-stop-shop for PIC and MEMS assembly, from design to volume production. We have a state-of-the-art production facility located in Enschede, the Netherlands, supporting the global industrial development of PIC and MEMS enabled modules.


 Press Releases

  • To continue to support our customers, PHIX is proud to have secured €3 million in new capital for the short term and €20 million for the long term from the National Growth Fund. In addition, PHIX will occupy a new building to support further industrialization and scaling of photonic chip packaging in large volumes. 

    The growth of integrated photonics

    Since the start of operations in 2018, PHIX has been building functional modules based on customer PICs (Photonic Integrated Circuits). In just a few years, we have established ourselves as one of the world leaders in this crucial position in the integrated photonics ecosystem. As the volumes of PICs are increasing, we are preparing for the next phase of growth to support our customers and the further industrialization of PIC based technologies in Europe.

    New investment round

    To continue the rapid growth trajectory, PHIX secured a new investment of €3 million that is split between €1.5 million in equity and €1.5 million in loans for new equipment. Only existing shareholders participated, demonstrating the confidence they have in PHIX’s growth and results. With the investment PHIX is able to further develop its automated packaging capabilities and increase capacity to continue to support the rapid growth of their existing and new customers.

    National Growth Fund

    As cornerstone of the PhotonDelta integrated photonics ecosystem, PHIX secured €20 million from the National Growth Fund (Nationaal Groeifonds). The photonics program involves a total investment of €1.1 billion to build 200 start-ups, scale up production, create new applications for photonic chips, and develop infrastructure and talent. Within this program PHIX takes a key role by being responsible for the industrialization of packaging and photonic chip assembly, in support of the broader Dutch ecosystem. The €20 million subsidy that PHIX receives in the program is part of a bigger growth plan of €40 million in the next 5 to 6 years, mainly to be invested in scaling of production.

    New building

    To support further industrialization and scaling of operations, PHIX will move to a new building in the Enschede Kennispark in the first quarter of 2023. The building with 1800 square meters of floor space on Hengelosestraat will be renovated to make room for at least 600 square meters of production facilities and 600 square meters of auxiliary workspaces, with plenty of room for expansion. The production facilities will house up to ISO 5 cleanrooms to ensure optimal working environments for the various stages of photonics assembly.


 Products

  • Prototype package
    Quick and affordable packaging solutions for chip characterization and system integration tests for your first photonic integrated circuits (PICs) or MEMS....

  • PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported.

    We encourage the choice for a standard housing. We have a choice of several open architecture characterization packages, as well as butterflies and gold boxes. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.

  • Volume package
    Assembling your photonic integrated circuits (PICs) or MEMS into functional modules in scalable volumes is PHIX’s core expertise....

  • We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as Silicon Photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.

    If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, in small batches and in high volumes. 

  • Contract manufacturing
    If you’re looking to outsource or second-source (steps of) the production of your Photonic IC enabled modules, PHIX is your perfect partner. We can run your manufacturing processes on our machines and provide engineering support....

  • Our team of highly experienced engineers can oversee the process transfer that implements your processes on our machines.

    Our extensive expertise in the assembly of photonic integrated circuits has already been recognized by the leading machine builder ficonTEC. Our partnership provides their customers with access to our process development services.

    Processes that we can provide for you are:

    • wafer dicing
    • die polishing
    • flip chip assembly
    • hybrid assembly
    • optical fiber (array) attachment
    • 3D printing of microlenses
    • wire bonding
    • glob top dispensing
    • hermetic sealing
    • testing and measurement

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