Boschman advanced packaging technology
Boschman is a high-tech, technology driven company, specialised in advanced back-end semiconductor packaging solutions.
We are headquartered in the Netherlands with a system assembly facility in Singapore and expanding in China.We focus on Pressure Sintering and Transfer Molding, two technologies that are in high demand now as the world is converting to high levels of electrification, creating unprecedented opportunities for companies active in the power electronics supply chain, like Boschman Advanced Packaging Technology.
Core to our strategy is a unique business model, “from Idea to Industrialization”, with 3 highly complementary activities:
Package Development: co-development of semiconductor packages and processes, including concept and design for manufacturing (DFM), prototyping and engineering samples for our (end) customers.
Assembly Services: small to medium volume micro assembly of MEMS, Sensors and Power Modules, with a fully equipped inhouse lab (from wafer dicing to die attach bonding, molding and laser marking).
Production Equipment: pressure sintering & transfer molding equipment, a range of systems from R&D Labs High Volume production solutions.