Heidelberg Instruments Mikrotechnik GmbH

Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning

Our small-area multipurpose Volume Pattern Generators VPG⁺ 200 / 400 are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput. The ability to expose SU-8 in fact makes the VPG⁺ a perfect solution for rapid prototyping of microfluidics or in other areas where thick negative resists are required. In effect, the Heidelberg Instruments small-area VPG⁺ 200 / 400 systems represent an excellent alternative to any i-line stepper. The systems can be used in a range of demanding fields that require microstructures: Typical applications include MEMS, advanced packaging, 3D integration, LED production and compound semiconductors.

DWL 2000 / 4000 GS laser lithography systems are fast and flexible high-resolution pattern generators. They are optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards. 

The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of up to 400 mm x 400 mm and optional automatic loading system, DWL 2000 / 4000 GS systems are particularly suitable for wafer-level micro-optics used for telecommunications, illumination and industrial display manufacturing, as well as for device fabrication in life sciences.