RENA Technologies GmbH

Höhenweg 1
Gütenbach,  D-78148

Germany
http://www.rena.com
  • Booth: C1724


Welcome to RENA Technologies GmbH!

About RENA Technologies GmbH

RENA - The art of wet processing.

RENA Technologies is the worldwide technological leader for wet chemical equipment. 

We provide the most valuable, innovative wet-chemical solutions or our clients to reach the next level of state-of-the-art.
We manufacture highest quality flexible and high-throughput equipment for producing semiconductor products for all manner of different sectors.
RENA equipment is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardized machines and guaranteed processes or entirely customized equipment.

We have 7 manfacturing sites, 5 innovation hubs and more than 3,300 machines installed worldwide. We are constantly developing the most efficient process for our clients to achieve perfect surface quality. With more than 130 engineers, 150 global service experts at 20 service locations we work to make RENA machines a long-term success story.

For more information, visit https://www.rena.com

 Products

  • FCS - Final Cleaning System
    Clean wafers are the basis for excellent semiconductor products. The fully automated RENA Final Cleaning System provides highest quality surfaces for the last wafering step....

    • Sophisticated processes and advanced scheduling make it the perfect solution for semiconductor wafer production with high throughput and challenging requirements.

    Product details:

    • Superior surface cleanliness for wafers up to 300 mm
    • Fully automated LMC carrier handling
    • Perfect finishing with RENA Marangoni Dryer
    • Standard SEMI interfaces for easy fab integration
  • BatchGlass LF HTX
    The BatchGlass LF HTX is a fully-automated wet processing tool for large size glass substrates....

    • RENA´s highly sophisticated hot alkaline etching tool can handle up to 600 x 600 mm2 glass panels. Showing highest performance in homogeneity for thinning as well as structuring and via etching processes. This is crucial for combined laser and etching applications like through glass vias (TGV) used in semiconductors and micro LED displays.

    Product details:

    • Advanced hot alkaline technology for selective and controlled etching
    • Highest homogeneity standards for hot alkaline etching
    • Etching after laser modification for TGV manufacturing
    • Highest surface cleanliness and quality
    • RENA CLEAN process specialized for silicate removal
    • Optimized footprint and compact design
    • 24/7 operation and easy upscaling of process
  • Electro Plating Manual – EPM 2
    Highest flexibility is required for pure metal and alloy deposition in the Microelectronic, Optoelectronic & Photonic chips market and its wide range of plating applications....

    • The EMP 2 is a compact electro-plating system for semiconductor device manufacturing and packaging applications, such as UBM, Bumping, Cu pillars, TSVs, Blind vias, RDL, Micro Forming and more. Homogeneous deposition at highest plating rates is ensured by optimized electrolyte flow and electrical field control in the fountain system. The plating tool operates manually and can be installed in R&D environments as well as in small scale production.

    Product Details:

    • Different substrate sizes
    • Adjustable wafer thickness
    • Plating materials:
      Pure metals: Cu, Au, Ni, In, Sn, Pt 
      Alloys: SnAg, PbSn, FeNi
  • Evolution
    The wet processing system "Evolution" is a fully automatic linear semiconductor wet bench. The modular structure is very flexible and can be easily configured according to your process sequences....

    • The Evolution's main feature is high yield, while maintaining a low cost of operation. The full-auto design features dry-in and dry-out processing with multiple, simultaneous lots batch processing.
    The advantageous of the "Evolution" controlling is the IDX Flexware software and one of the most advanced wet processing systems in these industry.
    Unique, advanced features and capabilities, including lot scheduling via the "Scheduler" from RENA, FlexView (optional).
    Multi-step processing in specialized process tanks, like Ultrasonic and Megasonic tanks, cascades or quick dump rinsing tanks, chemical dosing and monitoring (optional), multiple RENA´s drying solutions specified to your product, like Genesis Marangoni drying. A robust and reliable transfer robot.
    All RENA systems are available and compliant to the SECS/GEM interface of factory host.
    The Evolution is customized to your specific process requirements.

    Product Details:

    • Full-Auto, Dry-to-Dry operation
    • 100mm up to 200mm wafer sizes
    • 25, 50 and 100 wafer lots
    • IDX Flexware Control Software
    • Simultaneous Lots & Recipes
    • Advanced Process Monitoring
    • Integrated HMI Touchscreen
    • SECS/GEM Interface Options
    • Class 1 mini-environment
    • Stainless-steel version for Solvent application
    • Flexible and Upgradeable
    • Tailored to Customer Specification
    • Increased Uptime & Throughput
    • Extended Chemistry & Tank Life
    • Reduced Chemical & DI Water Usage
    • Lower Facility Costs

  • Revolution
    The Wet Processing System "Revolution" is a very flexible multi-step wet bench. Easy configurable for either semi-auto applications. The "Revolution" platform offers up to 5 process tanks located around its central rotary robot. ...

    • For your applications, is this the most ideal, low-cost solution for processes that require multistep sequence. There are many advantageous features for process control and monitoring in the IDX Flexware software. With a robust integrated rotary robot system, specialized process tank configurations RENA creates a powerful and versatile platform.

    At RENA equipment, the footprint is always a priority and kept minimal, of course all maintenance friendly.

    The "Revolution" also provides the RENA´s drying solution Genesis Marangoni drying for dry-in and dry-out processing.

    All RENA systems are available and compliant to the SECS/GEM interface of factory host.

    Product Details:

    • Dry-to-Dry Capabilities
    • 100mm up to 200mm wafer sizes
    • IDX Flexware Control Software
    • Multi-Step Sequences
    • Multiple Proprietary Technologies
    • HMI Touchscreen
    • Robust Rotary Robot
    • SECS/GEM Interface Options
    • Mini-environment as option
    • Stainless-steel version for Solvent application
    • Flexible and Upgradeable
    • Tailored to Customer Specification
    • Reduced Chemical & DI Water Usage
    • Lower Facility Costs

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Plating; Electro Chemical Plating for device assembly
  • Printed and Organic Electronic Equipment
    • 207 Process Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
    • 701 Manufacturing Services or Consulting
  • Assembly
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: laboratory
  • Equipment: Printing, coating
  • Equipment: Process integration & control
  • Equipment: Roll to roll

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