Develop the chips of the future with SET flip-chip bonders.
Founded in 1975, based in France, SET is a world leading supplier of high accuracy flip-chip bonders (chip-to-chip and chip-to-wafer) and versatile NanoImprint Lithography (NIL) solutions.
With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.
Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…
SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.