Ulvac GmbH

Klausnerring 4
Kirchheim b. München,  D-85551

Germany
http://www.ulvac.eu
  • Booth: C1746


ULVAC, solution Provider for Deposition/Etching/Ashing/Impl.

ULVAC GmbH was established in 1987 as the European subsidiary of ULVAC, Inc. Headquartered in Munich, Germany. From Munich our sales and service team serve EMEA region. ULVAC provides a very broad portfolio of manufacturing equipment for the vacuum, materials, and thin film industries. ULVAC’s solutions diversely incorporate equipment, materials, analysis, and services for semiconductors, MEMS, flat panel displays, electronic components, PCB, TFB. ULVAC delivers all types of vacuum products such as vacuum pumps and measurement and analysis equipment.

ULVAC offers state-of-art products and technologies for semiconductor and related processes. To support MEMS, power devices, NVM fabrication ULVAC offers a line of sputtering, evaporation, plasma etch, ashing equipment, ion implanting, oxidation/POA/Nitridization, and activation annealing for both R&D and manufacturing.

ULVAC has developed systems dedicated to advanced processing for thin film, lithium-ion battery manufacturing. This equipment range includes discrete (single) substrate battery fabrication for sputtering and evaporation.

Come by our booth and discuss your processing needs with our sales professionals.

 Products

  • Cluster-type Sputtering System SME-200
    The SME Series (SME-200) is a series of space-saving, low-cost cluster-type sputtering systems ideal for SAW devices and compound semiconductors. The SME-series lets you create a highly cost-effective line tailored to your application....

    • Features

    • For manufacturing of gate electrodes, capacitors, resistors and a wide range of components
    • Highly-reproducible, high-quality deposition
    • Choice of system configurations
    • Easy maintenance reduces down time
    • Outstanding film stress control and particle reduction

    Special Features

    • space-saving and highly cost-effective customized solutions

    Further Applications

    • MEMS devices
    • SAW Devices
    • Compound Semiconductors
  • Resist Strip System ENVIRO™ Optima
    Enviro Optima™ – The Resist Strip System with the Highest Throughput, in the Smallest Footprint, with the Lowest Cost....

    • The Enviro Optima™ Resist Strip System provides the highest throughput per square meter of cleanroom space at the lowest cost. Enviro Optima features a new remote plasma source achieving extremely quick resist removal rates of >10µm/min. Enviro Optima is the smallest 200mm resist strip system which offers 3 load-ports on the market. Combined with fast new wafer handling robotics, Enviro Optima’s straightforward design results in the highest throughput with the smallest footprint (67wph/m2) for systems under $1 million.
    With less cleanroom space required, and lower price than competitor’s models, this resist strip system delivers the lowest CoO, which is achieved by providing high throughput at lower total system cost. The Enviro Optima is ideal for all resist strip work including difficult to strip resists, like SU-8, residue removal, and surface preparation applications.

    Features

    • single wafer ashing system with one, two or three ashing modules
    • RF downstream plasma with >10 µ/min ash rate
    • compatible with Fluorine chemistry to remove tough resist/residue
    • thick resist strip, Descum, HDI resist, Polymer and Residue removal
    • backside bevel/edge clean
    • high throughput @ low footprint
  • High-temp Ion Implanter for SiC IH-860PSIC
    The Ion Implanter IH-860DSIC is a system especially designed for mass production with high temp ESC for SiC....

    • Features

    • Parallel beam high temperature ion implanter for SiC devices
    • 100mm/150mm wafer available
    • up to 500C with hot plate type ESC and pre-heat stage
    • Both hot plate ESC and cooling EXC are equipped
    • rapid heating and good temperature uniformity
    • 400keV single / 800keV double / 1.2MeV for triple Charge
    • Footprint 7.6m x 3.6m

    Further Applications

    • SiC devices
  • uGmni -200, 300
    Combined deposition and etch modules’ system of cluster type for advanced electronics uGmni-200, 300 Sputtering System, Load-lock type ...

    • uGmni is to equip with a variety of different process modules on the same transfer core which makes reducing spare parts by adopting the same common parts as much as possible as well as improves usability with the same operation panel between these different modules. This improves further efficiency for manufacturing process of advanced electronics.

    SPECIAL FEATURES APPLICATIONS

    • Power device　　  Seed & Metal layer Sputtering
    • MEMS sensor　　 PZT Sputtering & Etching
    • Opt. device　　　  VCSEL Etching
    • Packaging　　　　Descum Ashing
    • Communication　 Insulated film PE-CVD and Etching
  • Dry Vacuum Pump MS Series
    MS series is a vacuum pump which is categorized as screw type dry vacuum pump. Powder exhaust are improved as process resistance model based on traditional LS series....

    • Corrosion resistance by treating special coating for main parts such as rotor shaft and cylinder
    • High performance of powder exhausting by applying ULVAC’s unique design rotor shaft
    • Realize continuous pumping near atmospheric pressure

    SPECIAL FEATURES / FURTHER APPLICATIONS

    • Vacuum system for semiconductor and electronic device manufacturing equipment
    • Etching, Ashing, Plasma cleaning, etc.
    • Vacuum system for furnace
    • Sintering, Carburizing, etc.
    • Vacuum system for Li-ion battery manufacturing equipment
    • Electrode drying, Degassing, Vacuum injection, etc.
    • Vacuum system for medical and food
    • Freeze dry, Vacuum dry, etc.

Categories

201 Flat Panel Display Equipment
  • Alignment Film Coating Equipment
  • Anodic Oxidation Equipment
  • Color Pattern Processing Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 203 Inspection & Measurement Products
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Leak Detection Systems - Vacuum or Gas
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Thin Film
    • 207 Process Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 300 Packaging and Assembly Materials
  • Molding; Encapsulation; Potting; Resin Materials
  • Thin Film; Dielectric Film Materials
    • 307 Process Materials
  • Deposition/Target Materials
    • 400 Components, Parts & Accessories
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants
    • 401 Sub-systems
  • Power Supplies; RF Generators; Converters; Electrical Conditioning
  • Pumps, Vacuum
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Gas Monitoring Equipment; RGA's; TGO compliance
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: Printing, coating
  • Equipment: Roll to roll
  • Equipment: Systems
  • Equipment: Vacuum deposition
    • 904 Electronic Applications
  • Energy Efficiency: Power electronics
  • Healthcare: Device Implants
  • Healthcare: sensors
  • Lighting: LED
  • Lighting: OLED

    • Send Email

    Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined