Machines, Equipment and Consumables for Semiconductor and PV
ARRADIANCE: ALD, Atomic Layer Deposition
COREFLOW: Aeromechanical and Air Floating Solutions
CORNING TROPEL: Non-Contact Optical Metrology / Laser Interferometer
DARK FIELD: Inspection systems for automated defect and particle detection and metrology
ELECTRONIC CONTAINER: Wafer Carrier / Shipper
EURIS: Diamond Scrub Pads, Single Wafer Boxes, 2kW lamps for High-Temperature Epi-Processes, Solid CVD SiC products for Epi and MOCVD Processes
FORMFACTOR / FRT: Non-Contact Optical Surface and Form Metrology
GET CONTROL: E84 /Environmental Monitoring
JANDEL: 4 Point Probe Heads and Source-Meter
K&S: Advanced Vibration Isolation
LAMBDA–MICROCURE: Variable Frequency Microwave Curing
LUMETRICS: Optical Layer Thickness for Medical Device, Ophthalmic, Glass
MICROTECH: WET Stations, Gradient Dryer, Chemical Dispense
NANOSYSTEM: Optical 3-D Profiler for Roughness / Form; PCB Inspection
NAPSON: Sheet resistance / Resistivity with 4-pp and Eddy-Current / Carrier Lifetime Measurement
OKAMOTO: Machines for Grinding, Lapping, Polishing, CMP and TSV Processes / Ingot Grinder with XRA
UDM SYSTEMS: Dicing, Slicing, Cleaning