The nGauge from ICSPI is ideal as a complementary technique to typical metallurgical microscopy and can be used to inspect a variety of structural and material properties as well as grinding methodologies. 

The nGauge enables easy investigation of the thickness of thin films, coatings, and effectiveness of etching procedures, providing the user a significantly richer set of data than profilometry while maintaining the capability to obtain highly precise step height measurements.

It also determines surface finish, investigates the morphology and characterizes grain structure.

Capabilities

• Topography

• Roughness (Ra)

• Film thickness

• Phase imaging (mechanical properties)

• Particle size

Benefits

• AFM-on-a-chip

• AFM probe attached to a MEMS chip

• Integrated piezo resistive sensor (self-sensing)

• Vertical & lateral actuators (3-axis movement providing high speed scans)

• Laser-less (no laser alignment)

• Small & lightweight (vibration resistant)

• Easy to use (3 clicks for scan)

• Fast scans (10X faster time-to-data than traditional AFM)

• Large sample compatibility (100 mm x 50 mm x 18 mm)

FEATURES

• X-ray source up to 65 kV (For use in polymer, geological, pharmaceutical, bone and dental applications)
• Spatial resolution of 8 µm (Suitable for most day to day applications)
• Pixel size of 3.8 µm in full field-of-view of camera (Large format camera without compromising resolution)
• Low weight and compact design (Fits your desk)
• Only requires USB3 connection (Works with most laptops, tablets,...)

Non-destructive visualisation of all electronics inside a 128GB USB3 to USB-C flash drive using an N60 desktop microCT scanner.

Virtual sample cut ​

X-ray CT allows to virtually cut the scanned sample in any orientation for high resolution visualization and analysis of thin slices at any depth​

One single scan – multiple data​

One scan allows multiple analyses to be performed: dimensional​ measurements, material characterization, defects analyses and​ inspections of inner structures all in a non-destructive way​

Inspect and reproduce any assembly ​

X-ray CT provides a detailed rendering of all the internal and external features. Point clouds representing the surfaces can be extracted allowing parts to be easily reproduced even when CAD models are no longer available​

X-Ray Computed Tomography (CT) and Digital Radiography (DR) provide interesting results in order to help electronics experts

Live X-Ray Digital Radiography being available on all RX Solutions systems, it is very easy to detect broken bond wires or identify delamination issues by taking images of a component. The process is non-destructive, can be automated and if the supposed defective connection is not found then the part can be released without any modification. Moreover, preparing a sample to be scanned is no more than finding a support to hold it between the X-Ray tube and the detector.

Standard microscope inspection is often used in electronics but do not give same results because the majority of its components are hidden under other components, insulation or circuit boards. These superimposed features are not a limitation for X-Ray CT which can provide a three-dimensional model of any electrical connector or chip within a few minutes.

RX Solutions systems are designed to perform the best X-Ray Computed Tomography available on the market. With such technology electronics experts are now able to distinguish voiding due to gas bubbles in the solders, test Through-Silicon Vias (TSV) and find foreign object debris inside an electronic device without opening it.

Semiconductor devices generally consist of complex thin films containing many elements, and their development often requires non-destructive analysis of chemical states at interfaces.
HAXPES is necessary to acquire information from buried interfaces such as GaN under gate oxide film.

Features

• Fully automated
• Multi-tech XPS / HAXPES
• Easy Operation & Multi-technique Options
• High Performance Large & Micro Area XPS Analysis
• High Speed & Non Destructive Depth Profiling
• Fully Automated with Sample Parking
• Hard X-ray Cr Kα source for HAXPES
• Comprehensive solution for batteries, semiconductors, organic devices and other applications

Key added values

• Complex sample analysis
  Unique technology of multidimensional correlative imaging enables simultaneous acquisition of data from SEM and AFM, and their seamless correlation into 3D images.
• In-situ conditions
  All measurements are done at the same time, in the same place and under the same conditions, preventing the need of sample transfer and risk of contamination during analyses.
• Precise localization of the region of interest
  Extremly precise and time saving approach using SEM to localize and navigate the AFM to the region of interest.

Key benefits

• Enhancement of SEM capabilities
  AFM in SEM enhances the capabilities of both techniques, enabling complex sample analysis of electrical, mechanical and magnetic properties inside SEM.

• Ultimate precision of correlative imaging
  Unique Correlative Probe and Electron Microscopy (CPEM) technology enables simultaneous acquisition and correlation of the chosen SEM and AFM channels. 

• Fast & easy localization of region of interest
  SEM helps to quickly localize the region of interest and to precisely navigate the AFM tip.

• In-situ analysis - no risk of sample contamination 
  In-situ conditions inside the SEM ensure sample analysis at the same time, in the same place and under the same conditions. 

• Extension of 2D SEM image into 3D
  SEM material contrast is enhanced by the information about sub-nanometer 3D topography and roughness.