Powatec GmbH

Rothusstrasse 5a
Hünenberg,  CH-6331

Switzerland
http://www.powatec.com
  • Booth: B1909

Powatec is global provider of high quality assembly equipment and products for the Semiconductor and Electronics Industries. The core business encompasses manual/ semi automatic Wafer Mounters and UV-LED-curing products. Powatec offers a cutting service as well a wide range of accessories for the back end process such as Wafer Frame Carrier Magazines, Wafer Frames and Boats. POWATEC is headquartered in Hünenberg (Switzerland) with sales representatives in Singapore and USA.

 Products

  • Manual Wafer Mounter P-200 or P-300
    This standard wafer mounter ensures even and void fee lamination of tapes on 2" - 8" wafer (P-200) or 300mm Wafer (P-300)....

    • The wafer is placed onto a specifically selected carbon tissue to protect its sensitive surface during the mounting process. Each design detail has been optimized over 20 years and ensure highest quality at a reasonable investment. With a mounting time of less than 20 seconds, this Wafer Mounter is cabable to serve several dicing saws in parallel in a production facility. 

    • highly flexible: exchange of chucks, different tapes and frames
    • optionally available: automatic upwinding of UV protection film
    • optionally available: ionizing bar at the point of tearing off the tape
    • optionally available: non contact chuck, ceramic chuck, special shaped chucks
    • nearly maintenance free
    • customizations possible
  • UV Curing System U-200 and U-300
    The U-200 for 8" Wafer or U-300 for 300mm Wafer is an efficient LED UV solution for exposing wafer UV film. Usually this process step takes place after the separation of the wafer to reduce the adhesion force when picking the die....

    • U-200 for Wafer size up to 8" (200mm), U-300 for Wafer size up to 300mm
    • U-200 for Frame Size up to 296mm (corresponds to 8" Frame or DTF 2-8-1 standard)
    • U-300 for Frame Size up to 400mm (corresponds to 300mm Frame or DTF 2-12 standard)
    • Energy dose from 165 - 825 mJ/cm2
    • Homogeneity of Dose +/- 10%
    • U-200: Width x Depth x Height: 691 x 354 x 163 [mm]
    • U-300: Width x Depth x Height: 
    • Nitrogen purge available as option
    • UPH up to 200
    • Substrate or Wafer thicknes max 5mm. Option available for larger thicknes
  • Semi-Automatic Vacuum Wafer Mounter V-200 & V-300
    Fully automatic core process with high degree of process quality. Suitable for highest requirements in process stability, bumped Wafers or heated conditions. New design fully non-contact by 1st Q 2023....

    • V-200: Wafer Size up to 8" 

    V-300 for Wafer Size up to 300mm

    • No adjustment necessary for different Wafer thickness
    • Suitable for all types of UV tape
    • Process duration 45-60s
    • Vacuum pump optionally available
    • Note: Frame must be mounted with tape previously
    • optionally available with heated top and bottom chucks for bumped/structured wafers
    • fully non-contact solution available by 1st Q 2023
  • UF-300 semi-autmatic UV flash curing system
    for highest requirements in quality control, precision and efficiency in clean room application with 660 high performance UV LED's, fully SW controlled UV...

    • Suitable for Wafer size 300mm (12") or substrate up to 400x400mm2
    • Frame Size 12" (corresponds to Ø 400mm or DTF 2-12 standard)
    • Dose, intensity and exposure duration selectable in single digits on 10" display
    • Homogeneity of Dose +/- 5%
    • Nitrogen purge included
    • Optionally with journal cycle, API functionality and automatic calibratio
  • Manual Wafer Expansion Device ETN-150 or ETN-200
    The manual expansion tool is an effective solution to expand commercially available blue and UV tapes with grip rings on frames. UPH up to 120 expansions per hour with minimal instruction. The maintenance-free ETN ensures highly repeatable result quality....

    • ETN-150 for Wafer sizes up to 6" and corresponding Grip Ring/Hoop Ring

    ETN-200 for Wafer sizes of 8" or 300mm and corresponding Grip Ring/Hoop Ring

    • expansion of wafer on tape and frame
    • multiple expansions possible
    • optionally with heated chucks
  • Manual Wafer Laminator L-200 or L-300
    This Wafer Laminator is an effective solution for an air-void-free mounting of commercially available Back Grinding Tapes or protection Tape up to 300u thickness on wafers/substrates of up to 300mm and corresponding frame....

    • This Device offers Wafer protection with a tape for Back Grinding process (BG)

    • L-200 for Wafers up to 8"
    • L-300 for Wafers up to 300mm
    • Cutting mechanics does automatically adjust to the geometry of the wafer (e.g. flat)
    • optionally it is possible to cut the tape with tape excess around the wafer w/o touching the wafer
    • optionally availalbe with automatic protection film upwinder (PTW)
    • optionally available with ionising bar at the point of tearing off the tape

Categories

200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Dispensing Systems
  • Wafer Mount; Taping Equipment
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
  • Lamps (non Lithography), all type UV; LED and other
    • 700 Manufacturing Services
  • Sawing; Lapping; Grinding; Polishing Service
  • Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers
    • 701 Manufacturing Services or Consulting
  • Equipment; Hardware; Product Design, Integration and Manufacturing
  • Wafer Handling
    • 900 Support Products
  • Laboratory Apparatus and Supplies
  • Tools
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: Curing
    • 902 Other
  • Other

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