Sencio is an assembly design and manufacturing house
Sencio B.V. is a world class competence center offering development and manufacturing of functional semiconductor assembly solutions for MEMs and sensor systems. From design, package development and prototyping, industrialisation up to volume manufacturing Sencio works with the customer to carry out a product which fits to the desired mission profile.
nCapsulate functional packaging is achieved with a high versatility and compatibility with Sencio's other technologies from exposed die molding to multi-die packaging SiP, among many others. Freeform encapsulate packaging is giving the opportunity to shape the product to the exact requirements of the application. Embedding mechanical systems in electronics using nCapsulate offers a real practical solution for system challenges like improved alignment, mounting- and sealing-features, increased measurement accuracy and improved thermal contact.