ATV Technologie GmbH

Johann-Sebastian-Bach-Strasse 38
Vaterstetten,  D-85591

Germany
http://www.atv-tech.com
  • Booth: C1904


We are looking forward welcoming you on our booth C1904!

Founded in 1982 ATV Technologie GmbH is an international player in the field of micro electronics focussing on manufacturing and distribution of vacuum soldering devices and processing ovens.

Our Products:

PEO-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose,ultra-uniform, LPCVD, oxidation, high vacuum, annealing, alloying, LTCC sintering,thick film paste firing, Polyimide backing, Poly Si, Si3N4, P&N solid source diffusion

SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC, Flip Chip

SRO 7XX Series: IR Vacuum Reflow Systems for R&D and production, void free-IGBT-CSP-DBC, Flip Chip, package sealing  

SRO-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION

SRO-TCB THERMO COMPRESSION BONDER: 300°C, Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering,Cu pillar/micro bump flip chip soldering

DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs

 Products

  • PEO-604
    The PEO-604 is ideal tool for R&D purposes, pilot line and mass production. It can be applied easily for new unique and sophisticated process development as well low to medium volume production applications.......

    • This multipurpose furnace has several key aspects integrated and can handle wafers up to 200mm. Next to floor space saving advantages the PEO also has close to Zero energy usage in ambient stand-by. Another unique aspect of the system is the multi process capability when using our easily exchangeable liners. To reach the optimal temperature uniformity ATV uses 14 Kanthal heating elements which are positioned around, at the front and at the back side of the process tube and are PID controlled.

    For more details please visit https://www.atv-tech.com/peo-604.

Categories

200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Solder Reflow; Soldering & Brazing Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 207 Process Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment

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