TECHNIC France

Features

• Very stable electrolyte
• Low-stress deposit
• Smooth, bright deposit without the use of harmful metallic grain refiners
• Low deposit thickness variation across the wafer even with small and large features on the same die
• Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
• Extended bath life of 4 – 5 metal turnovers in most applications
• Currently in production around the world in high volume manufacturing

Benefits

• Reduced cost of operation through:

1. Extended bath life which significantly reduces the number of bath makeups per year
2. Stable electrolyte eliminates scrap produced from bath plate-out
3. Excellent coplanarity and step coverage resulting in less gold used per wafer
4. High-speed plating increases wafer production capabilities

• Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible.
• For use in plating tools from manual wet bench and R&D to fully automatic production lines.
• One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry.

Features

• Excellent selectivity
• Low undercut
• Improved etch uniformity
• Stable and consistent etch rate over the life of the bath
• Fluoride-free aqueous solution
• Compatible with most UBM and copper pillar integration materials
• Fully compatible with aluminum
• Tunable etch rate

Benefits

• High selectivity and low undercut provides high yields with fine pitch patterns
• Reduced cost of operation through extended bath life
• High process efficiency through stable chemistry and consistent etch rate
• Wide process operating window – 50% process overetch still results in minimal undercut

TechniStrip® P1331 offers full dissolution of liquid photoresist while assuring high metal compatibility and ultra-high bath loading compared to conventional TMAH/solvent blend photoresist strippers. With excellent performance on negative and positive tone photoresist, TechniStrip® P1331 can be used on a wide range of thicknesses from 1 – 220 microns. TechniStrip® P1331 is a multipurpose and versatile photoresist remover that is currently used in many applications, including gold bumping, copper pillar, aluminum contact stripping, post-RIE etch/ash, DUV, epoxy molding, debonding, and surface preparation.

TechniStrip® NF52 is formulated to provide powerful stripping performance on difficult to remove dryfilm photoresist and is the product of choice for many leading semiconductor manufacturers.

Features

• Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
• Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
• High stripping rate of > 10 µm/minute
• Long bath life
• Proven performance on both batch (spray and immersion) and single-wafer toolsets

Benefits

• Reduced cost of operation achieved through a highly efficient process and longer bath life
• Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
• High metal compatibility provides wider processing window and ease of operation
• CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators

TechniStrip® MLO 07 is a powerful DMSO based stripper that, in addition to its low toxicity, also provides many other benefits over NMP based strippers. This unique chemistry can also be used for metal lift-off applications. Metal lift-off is an alternative patterning method for etching. Metal lift-off is used for hard to etch or inert metals like gold.

Features

• Improved performance over NMP in many applications
• Provides dissolution for many positive resists
• High material compatibility on Cu, Sn, Ag, alumina, magnetic alloys and organic substrates
• Ideally suited for gold and other precious metal lift-off
• Formulated to minimize the formation of metal fragments during the lift-off process

Benefits

• Reduced cost of operation compared to NMP based products through process enhancement and extended bath life
• Elimination of exhausting harsh fumes from NMP
• Reduced defects by providing dissolution for a variety of resists and minimizing metal fragments during the lift-off process
• High material compatibility provides a wider processing window and ease of operation
• Enhanced safety for operators with a formulation that is NMP and TMAH free