UnitySC, headquartered in Montbonnot, France, is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with high depth of focus line scanning, temporal-mode interferometry, spectrometry and phase shift analysis. This enables customers to deliver higher yields and achieve faster time to market. UnitySC provides standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control.
Our Defect and Metrology solutions are used all the way through the chip making process, including in:
- Unpatterned wafers in Substrate fabs
- Patterned wafers in Front-end fabs
- Patterned wafers in Packaging fabs
- Chip2Wafer and Wafer2Wafer in Packaging fabs
- Glass & other transparent materials
- MEM’s process control
Some of our customer’s most common Metrology use-cases are:
- TSV (Through Silicon Via) metrology
- TTV (Total Thickness Variation of thin films and full-stacks/wafers)
- Bow/Warp
- Topology (Global & Local)
- Infra-Red Overlay (Wafer2Wafer / Chip2Wafer)
- Hybrid Bonding process control
Please contact our team with your process control requirements today!