Chip Integration Technology Center (CITC)
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. We have created an ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. Our contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Innovation
We organize and run the following innovation programs:
- Thermal High-Performance Packaging
- RF Chip Packaging
- Digital Package Manufacturing
- Integrated Photonics Packaging
Infrastructure
We maintain lab facilities that support the innovation programs, but also support the education programs through internships and MSc/PhD programs. CITC has a Smart Industry Field Lab status.
Education
We collaborate with universities, universities for applied sciences and companies to support and provide packaging and chip integration technology related education. This includes internships, MSc/PhD programs, and a specially developed Semiconductor Packaging University Program.