DISCO is a total solution provider for advanced Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies.
We can offer:
- Wafer dicing by blade, ablation laser, stealth laser and plasma
- Wafer thinning by grinding and stress relief (Dry Polishing, CMP and Plasma Etching)
- Various laser processes (KABRA, Laser Lift-Off, LEAF, via hole, curvilinear process, etc.)
- Unique solutions such as TAIKO, Dicing Before Grinding and more
- Surface planarization
- Dicing tape and Grinding tape
- Tape mounter / peeler
- Expander / Die separator
- Camtek AOI (Automatic Optical Inspection)
- Dicing-Grinding Service and Camtek optical inspection service in our cleanroom at Munich office. Please also visit https://www.dicing-grinding.com/