Applications: IC package testing, burn in (rom write) , memory inspection, interporser ...etc.
Features: Fine pitch and universal applicatrion, easy for maintenance /replacement.
Spec.: standard pitch:0.1/0.075/0.05/0.04 mm
L : H : Thickness: 50~5/ 50~5/ 0.15~2 mm
Angle : 63 / 75 / 90 degree
Temp: -40 ~+140 ℃
compression rate: 10~30%