Virtual sample cut
X-ray CT allows to virtually cut the scanned sample in any orientation for high resolution visualization and analysis of thin slices at any depth
One single scan – multiple data
One scan allows multiple analyses to be performed: dimensional measurements, material characterization, defects analyses and inspections of inner structures all in a non-destructive way
Inspect and reproduce any assembly
X-ray CT provides a detailed rendering of all the internal and external features. Point clouds representing the surfaces can be extracted allowing parts to be easily reproduced even when CAD models are no longer available
X-Ray Computed Tomography (CT) and Digital Radiography (DR) provide interesting results in order to help electronics experts
Live X-Ray Digital Radiography being available on all RX Solutions systems, it is very easy to detect broken bond wires or identify delamination issues by taking images of a component. The process is non-destructive, can be automated and if the supposed defective connection is not found then the part can be released without any modification. Moreover, preparing a sample to be scanned is no more than finding a support to hold it between the X-Ray tube and the detector.
Standard microscope inspection is often used in electronics but do not give same results because the majority of its components are hidden under other components, insulation or circuit boards. These superimposed features are not a limitation for X-Ray CT which can provide a three-dimensional model of any electrical connector or chip within a few minutes.
RX Solutions systems are designed to perform the best X-Ray Computed Tomography available on the market. With such technology electronics experts are now able to distinguish voiding due to gas bubbles in the solders, test Through-Silicon Vias (TSV) and find foreign object debris inside an electronic device without opening it.