RENA Technologies GmbH

RENA Revolution - semi-automated wet bench for multi-step processes

For multi-step semiconductor wet chemical processes, RENA offers flexible and compact semi-automated wet bench, the “Revolution”. This platform consists of a robust integrated central rotary robot and up to 5 process tanks located around the robot. The “Revolution” is the most ideal, minimal foot print and low cost solution for applications that require multi-step sequence of processes. It provides surface treatment of semiconductor wafers including etching, cleaning and resist stripping, both in FEoL and BEoL applications.

The “Revolution” delivers superior process control and monitoring achieved by employing IDX Flexware software. The IDX Flexware offers advantageous features and capabilities. Based on the customer requirements, specialized process tank configurations e.g. patented metal etching and metal lift-off tanks, can be incorporated into this chemical station. For dry-to-dry processes, the patented Genesis Marangoni dryers can be integrated.

All RENA systems are maintenance friendly and compliant to the SECS/GEM interface of factory host.

Features and Benefits

• Dry-to-Dry Capabilities
• 100mm up to 200mm wafer sizes
• IDX Flexware Control Software
• Multi-Step Sequences
• Multiple Proprietary Technologies
• HMI Touchscreen
• Robust Rotary Robot
• SECS/GEM Interface Options
• Mini-environment as option
• Stainless-steel version for Solvent application
• Flexible and Upgradeable
• Tailored to Customer Specification
• Reduced Chemical & DI Water Usage
• Lower Facility Costs

RENA Evolution - fully automated, dry-to-dry semiconductor manufacturing wet bench

For high throughput wet processing of semiconductor wafers, RENA offers the “Evolution”, a fully automated linear wet bench. Multiple surface treatment processes such as cleaning, etching, resist striping and drying can be performed using the “Evolution”. This chemical station has flexible modular design with robust transfer robot and can be customized according to your specific process sequences. The “Evolution” enables the batch processing of simultaneous wafer lots as well as dry-to-dry processing.

High production yield, low cost of operation and outstanding process control are the main features of this platform. This superior process control is achieved through IDX Flexware software, one of the most advanced in the semiconductor industry with unique features and capabilities. Specialized process tanks such as TruEtch, FluidJet and SiEtch and Ultrasonic and Megasonic tanks as well as patented Genesis Marangoni dryer can be integrated in “Evolution” to meet the customers process specifications.

All RENA systems are compliant to SECS/GEM interface of factory host.

Features and Benefits

• Full-Auto, Dry-to-Dry operation
• 100mm up to 200mm wafer sizes
• 25, 50 and 100 wafer lots
• IDX Flexware Control Software
• Simultaneous Lots & Recipes
• Advanced Process Monitoring
• Integrated HMI Touchscreen
• SECS/GEM Interface Options
• Class 1 mini-environment
• Stainless-steel version for Solvent application
• Flexible and Upgradeable
• Tailored to Customer Specification
• Increased Uptime & Throughput
• Extended Chemistry & Tank Life
• Reduced Chemical & DI Water Usage
• Lower Facility Costs

RENA Inception – Single wafer processing tool
Inception, the compact semi-automated single wafer processing system is an ideal solution for wet chemical cleaning, etching and resist tripping processes. This platform enables transition from R&D to pilot production in semiconductor manufacturing. Inception can be applied for acid applications in FEoL as well as solvent applications in BEoL. It provides superior etch uniformity <= 1% within wafer, from wafer to wafer and from lot to lot.

Inception consists of Dual moving spray arms with separate chemical lines which together with multiple tank design provides multi-step processing features. A variation of chucks are available for different wafer and substrate sizes to allow easy setup for different applications. RENA’s IDX Flexware software provides many advantageous features for process control and monitoring. All RENA systems are compliant to the SECS/GEM interface of factory host.

Features and Benefits

• Wafers up to 200mm and masks up to 7 x 7
• Etch uniformity exceeds batch systems
• Manual or automated wafer handling
• Single or dual load port
• 2 to 4 chemical process tank
• Hyper accurate concentration controls (ABB, Horiba, CI Semi)
• Hyper accurate spiking capability (Chemical & DI)
• Automatic chemical compensation for losses
• Small footprint