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Microcontrol Electronic SRL

Via Giuba 11
Milano,  I-20132

Italy
http://www.microcontrol.org
  • Booth: B1658


Come, visit, challenge us to meet your requirements!

Microcontrol Electronic srl has its headquarter in Milan - ITALY , and subsidiary offices in Roma and Catania. Founded in 1976 with the mission of servicing the Italian semiconductor market. In 1985 it started designing and manufacturing its own product line.  Microcontrol is now a  leading supplier of equipment and service for the worldwide microelectronic industry , its portfolio includes lamination, UV curing and handling systems, counting  more than 800 units installed in 20 different countries, continuoulsy supported by the technical service group. Microcontrol is renowned for the flexibility and reliability of its tools, and always committed to accept any new challenge of the semiconductor industry.  

 Products

  • LEONARDO DR series
    Photolitography - Dry Film Lamination ...

    • DR series: Lamination system to apply dry film resist on wafer for microsystem technology and Wafer Level Packaging.

  • LEONARDO DLO series
    Metalization - DRY METAL LIFTOFF...

    • DLO Series: fully automatic dry metal liftoff using adhesive tape
  • LEONARDO CLO series
    Debonding - Debonder...

    • CLO Series: Debonder for anodic bonded wafers or themal release tape bonded wafers
  • MWE 300 series
    UV curing systems ...

    • MWE 300: automatic systems to expose wafers to an UV light with a fully controlled process.

  • LEONARDO BG series & TK series
    Backgrinding - Tape Lamination & Removal...

    • BG series: state of art tape Lamination and Delamination systems for different processes (such as Back Grinding and Temporary Bonding) and semiconductor materials, including GaAs and GaN.

    TK series: Taiko wafers Delamination system inclusive of an in-line tape UV Curing station. The machine recipe parameters allow an excellent control of the tape peel off operation.

  • LEONARDO LD series
    Multiprocess cluster tool for tape lamination and/or removal...

    • LD series: The most flexible fully automatic machine of Microcontrol Electronic portfolio, it combines a Lamination and a Delamination process in a single tool

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wafer Mount; Taping Equipment
    • 202 Other Equipment
  • Lamination; Sheet Laminating Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Bumping Systems
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Transfer Systems for Wafer; Reticles or FPD's
    • 400 Components, Parts & Accessories
  • Lamps (non Lithography), all type UV; LED and other
    • 401 Sub-systems
  • Handling; Transfer; Loading Systems; Lifting devices
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
    • 701 Manufacturing Services or Consulting
  • Wafer Handling

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