scia Systems GmbH

The scia Mill 200 is designed for structuring of complex multilayers of various materials. For an exact process control different end point detection systems can be equipped. With its fully reactive gas compatibility the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows to adapt it as single substrate version as well as in high volume production cluster layout with up to three process chambers and two cassette load locks. 

Features & Benefits

• Etching angle adjustment with tiltable and rotatable substrate holder
• Excellent uniformity without shaper
• Enhanced selectivity and rate with reactive gases

Applications

• Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
• Milling of metals in MEMS production (Au, Ru, Ta, …)
• Milling of multilayers from diversified metal and dielectric materials
• RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
• Production of surface relief gratings (SRG)
• Ion beam smoothing for reduction of microroughness

The scia Magna 200 is used for precision wafer coatings by deposition of metals and/or dielectric layers. With its selectable sputter modes and arrangements the system can be configured according the customer requirements. In addition, the system is suitable for small scale R&D applications as well as for mass production, in cluster layout with software controlled automatic production.

Features & Benefits

• RF bias for conformity and stress control
• Superior uniformity with rotatable substrate holder
• Low substrate temperature with helium contacting and electrostatic chuck
• High deposition rates with reactive sputtering in unipolar and bipolar mode

Applications

• Temperature compensation films for TC-SAW devices (SiO₂)
• Piezoelectric films with excellent and defined crystal orientation (AlN)
• Optical high- and low-refractive coatings (SiO₂, TiO₂, HfO₂, ZrO₂, Nb₂O₅, Ta₂O₅)
• Electrical insulating films (Si₃N₄, SiO₂, Al₂O₃)
• Co-sputtering of metals and alloys

The scia Trim 200 is used for high precision surface trimming of wafers, without limitations in film and wafer materials. Designed for high-volume production the system has a throughput and maintenance optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.

Features & Benefits

• Significant yield improvement
• High precision and high throughput for low production costs
• No edge exclusion with electrostatic chuck
• Sub-nanometer removal with zero base etch function

Applications

• Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
• Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
• Film thickness error or step height correction in thin film head (TFH) manufacturing
• Dimensional correction of MEMS structures