lm Westpark 10 - 12
Wettenberg,  35435

  • Booth: B2905

We are looking forward seeing you at our booth B2.905!

PVA TePla - Globally active / At home with details

PVA TePla—is not just about high-tech products, innovative systems and materials, dynamic processes, experts, and companies. It means fully developed structures, an open corporate culture, and responsible actions. By linking with innovative strength, we open up clear competitive advantages for our customers in existing markets and in new application fields—from the semiconductor industry to vacuum technology all the way to material analysis. From PVA TePla, you can expect optimum possibilities for product development and market access—also in future.


  • Universal Loader Microscope (UL20x models) / wafer
    Purpose of Universal Loader Microscopes Automatic or manual visual microscope inspection of up to 200mm wafer, loaded automatically by the UL200 wafer loader from cassettes onto a motorized or manual xy table....

  • Key benefits:

    • Compact tabletop wafer loading system
    • Automatic loading of 100-200mm wafers with a compact waferloader
    • Microscope with remote interface control and laser autofocus
    • Micro defect inspection (>0.6µm)
    • Footprint approx. [mm] 1650x630

    ULx options:

    • Metrology software addon
    • 8” framed wafer cassette compatibility
    • SMIF wafer cassette compatibility
    • Enclosure with clean air flowbox
    • Infrared (IR) inspection technology
    • SECS/GEM compatible interface
  • Batch Wafer Systems
    The plasma systems for the batch process of PVA Metrology & Plasma Solutions all follow the same principle of plasma generation: direct coupling of the highly-frequency stimulation of the atmospheric side in the vacuum chamber....

  • The gas inlet is situated on one side of the chamber and the vacuum suction on the opposite side. This chamber geometry achieves a particularly consistent process outcome. The modular control system uses a latest-generation processor, a Linux-based platform as the operating system, and a graphical user interface (GUI). Consequently, the processes can be controlled both manually and fully automatically, and the process gases are controlled via MFC. During the process, all parameters are written into a recipe and stored in the database. In parallel with this, the current values for pressure, gas flow, output, etc. are shown on a display that triggers a corresponding alarm in the event of deviations from the target value.
  • Metrology Systems VPD
    With VPD technology, the surface of the substrate material is broken down in the gaseous phase and the reaction products are discharged....

  • Usually, the contamination previously present in the removed material is not transferred to the gaseous phase and remains on the surface. In the subsequent step, a fluid is dripped over the surface, where it gathers up the remaining impurities. The content of the drops can be analyzed by an ICP-MS or a TXRF, for example.


    • Modular design
    • The modules can be used individually or in fully automatic combination in different-sized system housings
    • Design as an analysis system with integrated ICP-MS
  • Metrology Systems Laser
    SIRD is a polariscope that can make visible stresses in materials that are transparent for the examination wavelength (e.g. silicon)....

  • The effect of stress-induced birefringence is used here: Defects and material inhomogeneities are often accompanied by stress fields whose spatial expansion is several times greater than that of the cause itself. If a material is exposed to shear stresses, its refractive index becomes anisotropic and the material becomes birefringent. Incident linear polarized light (laser) is therefore depolarized by the sample in transmission or reflection. Consequently, the obtained depolarization maps of SIRD can be interpreted as shear stress distributions.

    Intelligent software solutions help the SIRD system to convert the obtained maps into interpretable results efficiently.

  • Czochralski crystal growing systems
    The Czochralski crystal growing system CGS1218 is specially designed for the high demands of the semiconductor industry. It has a modular design and can be configured with either a cable or a crystal shaft....

  • The unique shaft configuration enables highest precision and therefore absolute linearity and reproducibility of the pulling speed. The CGS1218 features a multi-compartment chamber that allows for charging changes with reproducibility of thermal conditions in the process. The system is designed for hotzones from 32" - 36" and can be operated with single or dual camera systems via interactive software solutions.

  • Float Zone Systems
    The Float Zone (FZ) technology offers the possibility to produce ultra pure silicon monocrystals with high resistivity for applications in the field of high performance electronics and semiconductor technology....

  • Another advantage is the possibility of continuous doping from the gas phase, which enables a homogeneous resistivity distribution over the complete crystal length. As a result, the desired electrical properties can be achieved homogeneously over virtually the entire crystal. Due to the high charge carrier lifetimes and due to low degradation as a result of the extremely low oxygen content (crucible-free process), FZ crystals are also suitable for photovoltaics.

    Compared to competing methods such as the Czochralski process, the FZ process offers the advantage of lower costs for consumables (no quartz crucibles to be used only once), lower energy costs, since only a small area of the crystal in the immediate vicinity of the induction coil has to be melted, and a significantly higher pulling speed. Furthermore, it is possible to increase the purity of crystals - both from silicon and from other suitable materials - significantly step by step through multiple processing.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".