M-O-T Mikro- und Oberflächentechnik GmbH

The etching module μChem is a sufficient wet chemical process tool for all wet chemical process steps needed in the MEMS-, Semicon-, Optic- and Solar Industry. Because of the flexible arrangement and build-up, the etching system μChem is the ideal tool either for industrial or R&D demands. The complete buildup of the system is made of plastics (polypropylene (PP) white) to guarantees a maximal resistance against chemical attacks either of acids or bases. Of course, customized solutions are available after clearing the technical details

Applications: MEMS, CMOS, Sensor, PV, R&D or Production Type

Chemicals: non-organic like Acids and Alkali, SC1, SC2, Piranha

Main features:

• Batch or Single Wafer Version available for Cleaning, Etching, Dissolving
• Body material: PP white
• Bath materials: PP, PVDF, PTFE
• PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings

The MOT μSRD is an advanced Spin Rinse Dryer system developed by M-O-T GmbH. The μSRD is a wet process tool designed for cleaning and drying wafers for all batch applications. The standalone MOT μSRD is specially designed for easy operation and maintenance. A single cassette of wafers is placed in a stainless steel rotor. The complete buildup of the system is made of plastics (PP white) or stainless steel and guarantees therefore a maximal resistance against chemical attacks either of acids or bases.

FEATURES

• One chamber and double stack configurations
• Process of Wafer Baskets (25 wafers)
• High- or Low-Profile Cassettes
• Easy programming of rinse, dry and purge steps
• Balanced rotor with cassettes
• Electro polished Chamber and Rotor
• Easy exchange of Rotor

OPTIONS

• Chamber Ionization
• DI-Reclaim
• DI Heating System
• Tool less exchangeable insert made of plastic
• For running different wafer sizes
• Resistivity Monitoring

BUILD-UP

• Material: PP white, Stainless Steel
• Door material: PVC transparent

The electroforming unit μGalv-W is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry based on Wafer. Because of the flexible arrangement and build-up of the processes including process ramp-up, the electroforming unit μGalv-W is the ideal tool either  for industrial or R&D demands. Of course, customized solutions are available after clearing the technical details

Applications: Contact pads, Redistribution Layer RDL, Pillar, TSV fill, MEMS, Wafer Chip Scale Package (WCSP), Quantum technologies

Chemicals: acids or base electrolyte; sulphite base, alkaline base

• Electroforming of metals like Ni, Cu, Au, Ag, In
• Electroplating of alloy like NiFe, NiCo, NiW, SnPb …
• Electro less plating of Ni, Au, SnPb …
• Process cell build up possible as Rack Plater, Fountain tower or Flow Channel (tilted Wafer rotation)

• Material: PP white
• Pump: centrifugal pump made of PP, optional PVDF or PTFE
• Filter: PP 20", optional PVDF/PFA
• PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings

The electroforming unit μGalv-P is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry based on Panel. Because of the flexible arrangement and build-up of the processes including process ramp-up, the electroforming unit μGalv-P is the ideal tool either  for industrial or R&D demands. Of course, customized solutions are available after clearing the technical details.

PLATING MODULE

• Panel Size: min 300 x 300 mm
• Semi-Auto Handling
• Overflow process consisting of a process cell and reserve tank with filtration circuit
• Customized Chamber amount
• Electroforming of metals like Ni, Cu, Au, Ag, In
• Electroplating of alloy like NiFe, NiCo, NiW, SnPb …
• Process cell build up as Rack Plater,
• Pulse and Reverse Pulse Plating with minimum pulse time of 0.1 msec, optional complex wave forms like sinus, triangle etc.

RINSING MODULE

• Standard: Overflow Rinse,
• Optional: QDR,

General OPTIONS

• Fully Automatic Handling (Semi Auto, Dry in – out)
• Integration of pre/post process cells possible
• Integration of Laminar-Flow-Units
• Etching and Wetting Cells available
• FM 4910 proofed material optional

BUILD-UP

• Material: PP white
• Door material: PVC transparent
• Pump: centrifugal pump made of PP, optional PVDF or PTFE
• Filter: PP 20", optional PVDF/PFA
• PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
• HMI: IPC with Keyboard/Monitor
• IPC with PLC Control

Wafer Sizes: up to 300mm

Applications: fabricating Josephson junctions and superconducting quantum interference devices (SQUIDs) which is based on the local anodization of niobium strip lines

Chemicals: acids or base electrolyte;

Body material: PP

Bath materials: PP, PVDF, PTFE

Product Application: Wet Electrochemical Anodization

Plating Circuits: 1 Process Circuit: 1x Anodization (Material: PP) Fountain plater

Washing + Drying Step: 1x Hot-Wash and Drying Station (Material: PVDF) or IPA draying station (Material PP)

Chemical Dosing: Make up and dosing station (2 liquid chemicals)

Non-Uniformity: < 3% within wafer, measuring starting 5mm from substrate edge

Wafer to wafer: < 2% wafer to wafer

Compact laboratory tool μLab is a sufficient is compact and modular set up for manual handling & automated photolithography  processing. Such tool is required in the MEMS-, Semicon-, Optic- und Solar Industry. Because of the flexible arrangement and build-up, the laboratory tool μLab is the ideal tool either for industrial or R&D demands. It is able to integrate any different processing modules providing photoresist spin process, photoresist developing, spin cleaning and etching, HMDS vapour primer, hot plate and cold plates.

PROCESSING MODULE

• photoresists spin coater module, developer module, spin etching module, spin cleaning module with megasonic option;
• hot plates and cold plates, hmds primer;
• Customized process modules amount and Material Selection
• PLC controlled
• Touch Panel for easy operation

RINSING MODULE

• Sink and Overflow Rinse bath,
• Optional: QDR, SRD

General OPTIONS

• Drying shelf, electrical sockets;
• Integration of Laminar-Flow-Units
• Execution as fume hood
• FM 4910 proofed material

BUILD-UP

• Depend on process: SST or PP white
• Door material: PVC transparent
• PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
• HMI: Touch Panel