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TECHNIC France

15, Rue de la Montjoie
B.P. 79
La Plaine Saint Denis Cedex,  F-93212

France
http://www.technic.com
  • Booth: B1445


TECHNIC Advanced Engineered solutions for the electronics

A Global Leader in:
  Specialty Chemicals
  Surface Finishing Equipment
  Engineered Powders
  Analytical Controls
Technic offers a full range of chemistry for advanced semiconductor packaging. 
Marketed under the name Elevate, Technic’s electrodeposition chemistries are well 
respected for innovation and high-quality in such applications as RDL, pillars, microbumps, 
and LED packaging. Technic also supplies several high-performance photoresist strippers 
for liquid and dryfilm resists, as well as a full range of metal etchants and cleaners marketed 
under the names, TechniStrip®, TechniEtch, and Techniclean.
  • TechniClean: PER removers, PCMP Cleaning, ink remover, debonding, etc.
  • TechniStrip®: Liquid resist and laminated film strippers
  • TechniEtch: Selective barrier, seed layer, stack etchants
Technic offers a wide range of electroplating products for semiconductor applications, including:
Cu, Ni, Sn, Au, Au/Sn, In, commercialized under the Elevate®


 Products

  • Elevate® Gold 7990 NBV HT
    Stable, Environmentally Friendly, and Versatile Elevate Gold 7990 NBV HT eliminates the inherent weaknesses of traditional sulfite gold processes. Because Elevate Gold 7990 NBV HT operates at a pH of 6.3, it is compatible with all photoresists....

  • Features

    • Very stable electrolyte
    • Low-stress deposit
    • Smooth, bright deposit without the use of harmful metallic grain refiners
    • Low deposit thickness variation across the wafer even with small and large features on the same die
    • Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
    • Extended bath life of 4 – 5 metal turnovers in most applications
    • Currently in production around the world in high volume manufacturing

    Benefits

    Reduced cost of operation through:

    • Extended bath life which significantly reduces the number of bath makeups per year
    • Stable electrolyte eliminates scrap produced from bath plate-out
    • Excellent coplanarity and step coverage resulting in less gold used per wafer
    • High-speed plating increases wafer production capabilities

    • Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible.
    • For use in plating tools from manual wet bench and R&D to fully automatic production lines.
    • One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry.
  • TechniEtch TBR19
    High-Performance Etchant TechniEtch TBR19 is a stabilized hydrogen peroxide based metal etchant that is extremely selective with a very low undercut value of < 0.2 microns...

  • Features

    • Excellent selectivity
    • Low undercut
    • Improved etch uniformity
    • Stable and consistent etch rate over the life of the bath
    • Fluoride-free aqueous solution
    • Compatible with most UBM and copper pillar integration materials
    • Fully compatible with aluminum
    • Tunable etch rate


    Benefits

    • High selectivity and low undercut provides high yields with fine pitch patterns
    • Reduced cost of operation through extended bath life
    • High process efficiency through stable chemistry and consistent etch rate
    • Wide process operating window – 50% process overetch still results in minimal undercut
  • TechniStrip® P1331
    Photoresist Stripper High/Rapid Dissolution, High Metal Compatibility NMP-Free Stripper...

  • TechniStrip® P1331 offers full dissolution of liquid photoresist while assuring high metal compatibility and ultra-high bath loading compared to conventional TMAH/solvent blend photoresist strippers. With excellent performance on negative and positive tone photoresist, TechniStrip® P1331 can be used on a wide range of thicknesses from 1 – 220 microns. TechniStrip® P1331 is a multipurpose and versatile photoresist remover that is currently used in many applications, including gold bumping, copper pillar, aluminum contact stripping, post-RIE etch/ash, DUV, epoxy molding, debonding, and surface preparation.

  • TechniStrip® NF52
    High Dissolution, High Metal Compatibility NMP-Free Photoresist Stripper...

  • TechniStrip® NF52 is formulated to provide powerful stripping performance on difficult to remove dryfilm photoresist and is the product of choice for many leading semiconductor manufacturers.

    Features

    • Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
    • Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
    • High stripping rate of > 10 µm/minute
    • Long bath life
    • Proven performance on both batch (spray and immersion) and single-wafer toolsets

    Benefits

    • Reduced cost of operation achieved through a highly efficient process and longer bath life
    • Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
    • High metal compatibility provides wider processing window and ease of operation
    • CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators
  • TechniStrip® MLO 07
    Advanced, High-Performance DMSO Based Stripper...

  • TechniStrip® MLO 07 is a powerful DMSO based stripper that, in addition to its low toxicity, also provides many other benefits over NMP based strippers. This unique chemistry can also be used for metal lift-off applications. Metal lift-off is an alternative patterning method for etching. Metal lift-off is used for hard to etch or inert metals like gold.

    Features

    • Improved performance over NMP in many applications
    • Provides dissolution for many positive resists
    • High material compatibility on Cu, Sn, Ag, alumina, magnetic alloys and organic substrates
    • Ideally suited for gold and other precious metal lift-off
    • Formulated to minimize the formation of metal fragments during the lift-off process

    Benefits

    • Reduced cost of operation compared to NMP based products through process enhancement and extended bath life
    • Elimination of exhausting harsh fumes from NMP
    • Reduced defects by providing dissolution for a variety of resists and minimizing metal fragments during the lift-off process
    • High material compatibility provides a wider processing window and ease of operation
    • Enhanced safety for operators with a formulation that is NMP and TMAH free 

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