TechniStrip® P1331 offers full dissolution of liquid photoresist while assuring high metal compatibility and ultra-high bath loading compared to conventional TMAH/solvent blend photoresist strippers. With excellent performance on negative and positive tone photoresist, TechniStrip® P1331 can be used on a wide range of thicknesses from 1 – 220 microns. TechniStrip® P1331 is a multipurpose and versatile photoresist remover that is currently used in many applications, including gold bumping, copper pillar, aluminum contact stripping, post-RIE etch/ash, DUV, epoxy molding, debonding, and surface preparation.