LIDROTEC cuts microchips more efficiently than any other current technology. The unique innovation of our machine is the combination of a laser with liquids. The liquids cool and rinse the material while it is being cut with an ultrashort-pulse (USP) laser. Minimum induction of heat as well as the rinsing of debris enable microchip production with no micro cracks, no chipping and no debris on the surface. Hence, the rate of damaged microchips during the dicing process is reduced to virtually 0%. This saves material costs and increase profitability for semiconductor producers. Additionally, valuable resources that are used to build microchips, such as rare earths or gold, can be saved, helping with the conservation of resources.