131 Impasse Barteudet
Saint Jeoire,  F-74490

  • Booth: B1474


SET is a world leading supplier of high accuracy Flip-Chip Bonders (Chip-to-Chip and Chip-to-Wafer) and versatile NanoImprint Lithography (NIL) solutions.

Since 1975, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.

Based in France, we accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components.

With Flip-Chip Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its equipment.

Ranging from manual loading to fully automated version, our Flip-Chip Bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrates up to 300 mm.

SET offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.


  • ACCµRA M
    The ACCμRA M is a manual Flip-Chip Bonder that allows ± 3 μm post-bond accuracy. This equipment permits to align manually the components with a high level of precision....

  • More than a pick-and-place system, the ACCμRA M offers thermocompression and reflow capabilities
    It is the perfect equipment for universities and R&D institutes.

    The ACCµRA100 and the ACCµRA OPTO are semi-automatic Flip-Chip Bonders that guarantee ± 0.5 µm post-bond accuracy. Their flexibility makes them ideal for developing a wide range of applications....

  • The ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
    ACCμRA OPTO is dedicated to low force and reflow processes. It is the perfect equipment for optoelectronics and silicon photonics applications.

  • ACCµRA Plus
    The ACCμRA Plus is a Flip-Chip Bonder designed for ± 0.5 μm @ 3 σ post-bond accuracy in full automatic mode....

  • It is suitable for reflow and thermocompression processes.
    The ACCμRA Plus combines high precision, flexibility and short cycle time.                                

    It is dedicated to production for optoelectronic and silicon photonics applications.

  • FC150 PLATINUM / FC300
    The FC150 PLATINUM permits to reach ± 0.7 µm post-bond accuracy. The FC300 is a high accuracy and high force system for Chip-to-Chip -up to 100 mm- and Chip-to-Wafer -up to 300 mm- applications with ± 0.3 µm post-bond accuracy. ...

  • The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

    Ranging from manual to full automation, the FC300 provides development and production capabilities on a single upgradable cost-effective platform.

  • NEO HB
    With ± 0.5 µm @ 3 σ post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic Flip-Chip Bonder designed for production....

  • Combining high precision, flexibility and very short cycle time, it is perfectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.

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