Darmstadt,  D-64297

  • Booth: B0706

We look forward to seeing you at our booth at Silicon Saxony

ISRA VISION is a leading provider of technologies for industrial image processing (machine vision). As part of the Atlas Copco Group, a global leading provider of sustainable productivity solutions, we offer an extensive range of solutions for surface inspection, robot guidance and automated metrology. With around 1,200 employees, we supply customers in 16 markets and in a wide range of industries. Headquartered in Darmstadt, Germany, we deliver value to our customers through a global organization under the ISRA VISION, Perceptron and QUISS brands.


  • CrackScan
    Pre-Polishing inspection of the bulk wafer material...

  • The CrackScan optical inspection system precisely detects and identifies tiny cracks inside a wafer. The high-speed line scan cameras reliably detect defects such as LLS, PID, or COP with the highest precision, even at maximum throughput rates.

    The system is easy to integrate into existing fully automated production lines. CrackScan can be used either as a standalone system or combined in a cluster with other inspection processes like WafQScan and SpecGAGE3D. CrackScan can be supplemented with EdgeScan to detect defects like chippings and scratches on the wafer edge. 

  • EdgeScan
    Wafer edge inspection before and after the polishing...

  • The EdgeScan inspection tool enables 100% inspection of the wafer edge. Integrated on the pre-aligner, the sensor creates a triple view of the edge with just one camera. 

    The system reliably detects defects such as chippings, scratches, grinding marks, and other residues, even in the micrometer range. 
  • WafQScan
    Post-Polishing inspection of the wafer surface...

  • WafQScan enables 100% inline surface inspection of semiconductor wafers. Using pixel-synchronous images captured under different illumination scenarios, the patented MultiView technology ensures excellent defect detection rates in a single scan. WafQScan is the ideal solution for applications for bare, cut and processed wafers.

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