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HQ-Dielectrics GmbH

Postfach 49
Dornstadt,  D-89156

Germany
http://www.hq-dielectrics.eu
  • Booth: B1221


Rapid Thermal Processing / Plasma Processing

HQ-Dielectrics is company with core competence in RTP & Plasma Processing and unique expertise in technology, process and plant engineering for fabs and R&D. HQ-D supports projects with know-how, develops and adapts automation solutions for existing production lines. As an SME, we offer customer-specific and standard solutions. Our RTP and microwave excitation training courses focus on customer requirements and interests.

Inovating Technology by HQ-Dielectrics

 Press Releases

  • Latest product: fully automatic 200mm RTP with a footprint of approx. 3 square metres for processing under vacuum and atmospheric conditions. Processing can be carried out with or without a graphite box. For applications up to 1400 degrees Celsius.

 Products

  • Hemera
    Rapid Thermal Processing System with a flexible setup for either research and process development or fully equipped for pilot and mass production. Wafer sizes can be rapidly changed in a range from 75 mm up to 200 mm wafers....

    • Key Features

    • Flexible setup
    • Precise ambient control
    • Vacuum capability
    • Advanced temperature measurement,

    50 < T < 1300 °C

    • Independent lamp and power control
    • Spike annealing
    • Ultra-fast cooling

    Applications for Si, Ge, GaAs, GaN, SiC, etc.

    • Annealing / dopant activation
    • Oxidation
    • ONO (Oxidation – Nitridation – Oxidation)
    • Ohmic contact formation
    • Silicide formation (NiSi, CoSi2, TiSi2)
    • Densification

Categories

101 Photovoltaic Device Manufacturing
  • PV: Cells
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 203 Inspection & Measurement Products
  • Thermal Sensing, Measurement, Analysis
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Thin Film
    • 207 Process Equipment
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 300 Packaging and Assembly Materials
  • Thermal Interface Materials; Heat Sinks
    • 308 Substrates
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • Thin & Thick film substrates for MEMS
    • 401 Sub-systems
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers

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