OEG GmbH

• Home
• Products

The company OEG GmbH was founded in 1991 and deals with the development and production of high-precision automatic optical measuring systems for industry and research. OEG GmbH focuses on measuring systems for optical, geometric and physical parameters. We are proud that OEG devices are now installed on all continents. This fact proves the efficiency and innovative strength of the OEG engineers and technicians. In addition to other branches of industry, OEG GmbH has numerous customers in semiconductor technology. The core product is the fully automatic contact angle measuring device SURFTENS WH 300. With a wafer robot, load port, SECS/GEM interface and a fully automatic measurement process, it meets all the requirements for use in highly automated wafer fabs. OEG GmbH also offers devices for research in the semiconductor sector. These include the precision diamond scriber MR 200, the wafer stress measuring device FLATSCAN and various other types of manual and semi-automatic contact angle measuring devices. The product range is supplemented by an image processing system for criticle dimension (CD) measurement, which can be retrofitted to existing microscopes.

SURFTENS WH 300

Fully automatic contact angle measuring instrument with wafer robot, loadport and SECS/GEM interface for 8" and 12" wafer technology. ... More Info Less Info







Technical background

Surface tension of photolithographic materials like resist and developer has a great potential for the photolithographic process itself. For instance, homogeneity of spin coatings, planarization, and adhesion depend directly on surface tension of the materials involved. The SURFTENS WH 300 contact angle meter serves for the measurement of contact angle and surface free energy (SFE) in semiconductor technology and provides the complete functionality, which is required in 300mm wafer fab´s. This makes the device unique worldwide.

Main features of SURFTENS WH 300

-3 axis wafer handling robot

-loadport for 12" FOUP

-SECS / GEM interface

-optional bridge tool for 8" OC

-video system for automatic drop shape analysis

-wafer scanner

-centring & notching before measurement

-automatic, software controlled dosing system

-tank for main dosing system (DI water)

-automatic, software controlled refill of main dosing system

-optional second dosing system for other test liquids

-filter fan unit

-optional hotplate for evaporating of water drops

-optional additional measuring system for resist edge evaluation

- single cable connection to the main power distribution unit of the instrument

- EMO is integrated

Website: https://www.oeggmbh.com/?p=12&k=6&kj=&z=&l=1

Video: https://www.youtube.com/watch?v=whR8E1yTHC8



Precision Diamond Scriber MR200

MR 200 serves for the precise manual scribing for accurate cutting of structured silicon wafers. MR 200 is the ideal tool for REM-preparations in semiconductor technology.... More Info Less Info







Precision-Diamond-Scriber MR 200
Precision diamond scriber for manual precise scribing for defined cutting of structured silicon wafers (other materials on inquiry)

MR 200 - the ideal tool for REM-preparations in semiconductor technology
The setup and the equipment of MR 200 provids high precision scribing for defined cutting of structured silicon wafers.
The MR 200 is an indispensable tool, in particular for REM preparations in semiconductor technology. 
The MR 200 is also suited for singling of chips in low numbers, for example in laboratory use.

MR 200 consists of:
- stable basic frame
- electro-magnetic set down of the scribing diamond by foot switch
- high quality zoom microscope with stepless adjustment of magnification
-- including adapter for ring light
- eye piece with hair cross for exact positioning of specimen to edges, structures, reference marks etc.
- manual x/y-table with rough-/fine positioning, (200 x 200)mm stroke
- 200mm vacuum wafer chuck (100mm on inquiry) teflon coated, mounted on x/y-table
-- Vacuum hole (4 x 18)mm, other sizes or pattern are possible on request
- 200mm digital gauge, readout 10 micron
- scribing diamond tip
- numerous adjustment elements (see technical parameters)
- LED ring light with controller and power supply

Technical parameters
- fine positioning of x/y-table by micrometer screw for exact alignment of reference marks to scribing line
-- 25mm in x (transverse to scribing direction)
-- 200mm digital gauge, readout 10micron (transverse to scribing direction)
-- 10mm in y (in scribing direction)
- angle fine adjustment of wafer chuck by micrometer screw  (10µm resolution = 0,006°)
- manually x/y-table, stroke (200 x 200)mm
- defined 90°-rotation of wafer-chuck without vacuum switch-off for exact 90°-scribing
- adjustable stops for 90°-rotation
- adjustable work angle for scribing diamond
- set down of scribing diamond by foot switch
- adjustable lowering speed of scribing diamond
- adjustable scribing power (10g....120g, others on inquiry)
- adjustable height of scribing diamond for different specimen thicknesses
- microscope features
-- Microscope magnification 8x ... 40x
-- resolution of optics better 10µm at magnification 40x
- materials: Silicon, all monocrystalline materials
- smallest specimen size: (10 x 10)mm
- dimensions: appr.  (430 x 700 x 550) mm (B x T x H)
- weight appr. 16kg

The MR 200 can be equipped with a video system for an even more comfortable operation.



SURFTENS HL

SURFTENS HL 200 is a manually operated tool for contact angle measurement of Si-wafers. SURFTENS HL 200 meet the needs for a fast, highly accurate and comfortable measurement of the wettability of silicon wafers.... More Info Less Info







Background

Surface tension of photolithographic materials like resist and developer has a great potential for the photolithographic process itself. 
For instance, homogeneity of spin coatings, planarization, and adhesion depend directly on surface tension of the materials involved. 
The same applys to the surface free energy (SFE) of coatings.
Surface free energy (SFE) of substrates and layers, used in semiconductor technology can be investigated by contact angle measurement. 
Measuring the contact angle allows you to quickly optimize new process steps as well as to better standardize known processes. 
Small changes in the surface property of wafers are seen as large, easily detected changes in the contact angle. 
A small investment of time to measure the contact angle, can give a large return by avoiding later production problems. 
To reduce defect density and feature sizes of resist structures (<1μm), a good adhesion of the resist is necessary. 
By the help of contact angle measurement, you can control the adhesion very easily.
The contact angle measuring system SURFTENS HL 200 has been specially designed for use in the semiconductor industry and research, especially for process control in the surface treatment of Si wafers. 
It is the ideal tool, to investigate contact angle and wettability of wafers. SURFTENS HL 200 meet the needs for a fast, highly accurate and comfortable measurement of the wettability of silicon wafers.
The drop of test liquid (typically DI water) is produced by the manual or automatic direct dosing unit. The image of the drop appears immediately as a high quality, live video picture at the PC screen.  
The Measurement is started by a single keystroke. The software determines the contact angle and immediately presents it graphically with numerical data included. Fast measuring times of only 1 second per drop exclude errors. 

SURFTENS HL 200 guarantees highest reproducibility and measuring accuracy combined with ease of operation. 
In the case of poor contrast images (can be caused by special coatings), a manual measuring function can be used.

Features

SURFTENS HL consisting of:
-compact space-saving, closed mechanical basic setup
--high quality measuring objective, fixed focus
--USB camera
All components are integrated in a closed housing and protected against misalignment.
-homogeneous, bright LED lighting, adjustable
-wafer table, 200mm diameter, teflon-coated with:
--manual positioning in x- and phi-direction
--wafer can be placed by vacuum tweezers
-stroke of wafer table: 100mm
-rotation of wafer table: 360° (each point on the wafer is accessible for contact angle measurement)

The manual x and phi axes of the wafer-table are equipped with a scale so that defined positions can be approached.

Adjustments for dosing system(s):
--manual z-axis for adjustment of needle position (height)
--manual y-axis for adjustment of needle position (centring)
--manual x-axis for adjustment of needle position (focus)

Website: https://www.oeggmbh.com/?p=12&k=5&kj=&z=&l=1



COMEF Software for line width and CD measurement

COMEF image processing software features the easy and accurate measurement of line width, critical dimension (CD) and grid cycle.... More Info Less Info







COMEF
Software for line width and CD measurement

COMEF image processing software features the  easy and accurate measurement of line width, critical dimension (CD) and grid cycle. The COMEF measuring functions are based on grey value processing with subpixel accuracy. Beside the measuring functions, COMEF offers the comfortable documentation of the results in the digital image, in txt-files and in protocols.

Camera interfaces and use with existing microscopes
COMEF offers numerous interfaces to digital USB 2.0 cameras or any kind of analogue CCD-videocamera. 
Therefore the software is perfect suited for upgrading existing microscopes.


Measuring accuracy
The accuracy is 1/10 of a camera pixel. 
For practical use therefore the accuracy depends from the pixel size of the camera and the magnification of the optics between camera chip and object. 
For a pixel size of 5 micron and a magnification of 10x the accuracy results to 50nm. Surely, the accuracy is limited by physical laws like diffraction and the dependence of the objective resolution from the numeral aperture of the measuring objective.

Website: https://www.oeggmbh.com/?p=12&k=47&kj=&z=&l=1

Download demosoftware: https://www.oeggmbh.com/?p=5&d=1&l=1



AC-RS Wireless Autocollimation Sensor

AC-RS is an electronic autocollimator, that can be operated remotely and completely wireless.... More Info Less Info







AC-RS The Wireless Autocollimation Sensor

Features
-completely wireless operation
-the autocollimator can be completely remote controlled
-simultaneous measurement in 2 axes
-AC-RS can be used as a standalone device
-integrated into any existing WiFi-Network
-AC-RS can host its own WiFi Network (Hotspot)
-AC-RS runs a TCP/IP-Server to integrate it in any customer specific application
-special software applications can run on a Laptop, connected by WiFi
-a rechargeable battery to enables completely wireless operation for several hours
-continuous operation is possible with a wired power supply

Applications
There are a lot of applications for the optical high precision measurement of small angles. Applications in optical setups are for instance:
-alignment of optical beams
-high precision angle adjustment of optical components
-calibration of optical components
-measurement of deflection- and reflection angles
-measurement of centring error
-angle position monitoring

There are also many applications in the mechanical engineering for the measurement of:

-straightness, parallelism, squareness and angular tilting of mechanical guides
-flatness
-position uncertainty of indexing tables

OEG GmbH offers the appropriate software products for use in optics as well as for mechanical engineering.

Website: https://www.oeggmbh.com/?p=12&k=68&kj=&z=&l=1